Anno; Toshihiko
Patent Applications and Registrations
Patent applications and USPTO patent grants for Anno; Toshihiko.The latest application filed is for "method of manufacturing polyimide film and tenter apparatus".
- Anno; Toshihiko - Ube N/A JP
- Anno; Toshihiko - Ube-shi JP
- Anno; Toshihiko - Yamaguchi JP
- Anno; Toshihiko - Kyoto JP
| Patent | Date |
|---|---|
| Method of manufacturing polyimide film and tenter apparatus Grant 9,352,498 - Ikeuchi , et al. May 31, 2 | 2016-05-31 |
| Method Of Manufacturing Polyimide Film And Tenter Apparatus App 20120193829 - Ikeuchi; Hiroyuki ; et al. | 2012-08-02 |
| Adhesion-enhanced polyimide film, process for its production, and laminated body Grant 8,053,082 - Hashimoto , et al. November 8, 2 | 2011-11-08 |
| Copper-clad laminate Grant 7,998,553 - Narui , et al. August 16, 2 | 2011-08-16 |
| Copper-clad Laminate App 20100316884 - Narui; Kohji ; et al. | 2010-12-16 |
| Adhesion-Enhanced Polyimide Film, Process for Its Production, And Laminated Body App 20070196675 - Hashimoto; Masafumi ; et al. | 2007-08-23 |
| Easily slidable polyimide film and substrate employing it Grant 7,186,456 - Hashimoto , et al. March 6, 2 | 2007-03-06 |
| Polyimide-copper composite laminate App 20060154037 - Shimokawa; Hiroto ; et al. | 2006-07-13 |
| Copper-clad laminate Grant 6,924,024 - Narui , et al. August 2, 2 | 2005-08-02 |
| Easily slidable polyimide film and substrate employing it App 20050074592 - Hashimoto, Masafumi ; et al. | 2005-04-07 |
| Aromatic polyimide film for electro-conductive sealing element of packaged semi-conductor device Grant 6,838,184 - Takahashi , et al. January 4, 2 | 2005-01-04 |
| Method of making a polyimide film having a thin metal layer Grant 6,824,827 - Katsuki , et al. November 30, 2 | 2004-11-30 |
| Copper-clad laminate App 20040110015 - Narui, Kohji ; et al. | 2004-06-10 |
| Surface treatment of polyimide film and polyimide film having a thin metal layer App 20040076765 - Katsuki, Shozo ; et al. | 2004-04-22 |
| Metal film/aromatic polyimide film laminate Grant 6,699,572 - Yamamoto , et al. March 2, 2 | 2004-03-02 |
| Aromatic polyimide film for electro-conductive sealing element of packaged semi-conductor device App 20030180557 - Takahashi, Takuji ; et al. | 2003-09-25 |
| Surface treatment of polyimide film and polyimide film having a thin metal layer App 20020177000 - Katsuki, Shozo ; et al. | 2002-11-28 |
| Metal film/aromatic polyimide film laminate App 20020090524 - Yamamoto, Tomohiko ; et al. | 2002-07-11 |
| Magnetoresistance effect element Grant 5,514,469 - Shinjo , et al. May 7, 1 | 1996-05-07 |
| Magnetoresistance effect element Grant 5,462,795 - Shinjo , et al. October 31, 1 | 1995-10-31 |
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