loadpatents
Patent applications and USPTO patent grants for Anjo; Ichiro.The latest application filed is for "bga semiconductor device having a dummy bump".
Patent | Date |
---|---|
BGA semiconductor device having a dummy bump Grant 8,222,737 - Watanabe , et al. July 17, 2 | 2012-07-17 |
BGA semiconductor device having a dummy bump Grant 8,164,186 - Watanabe , et al. April 24, 2 | 2012-04-24 |
Bga Semiconductor Device Having A Dummy Bump App 20100295179 - Watanabe; Yuji ;   et al. | 2010-11-25 |
Semiconductor package with reduced length interconnect and manufacturing method thereof Grant 7,812,439 - Watanabe , et al. October 12, 2 | 2010-10-12 |
DRAM stacked package, DIMM, and semiconductor manufacturing method Grant 7,546,506 - Sonoda , et al. June 9, 2 | 2009-06-09 |
Semiconductor Apparatus And Manufacturing Method Of Semiconductor Apparatus App 20090014874 - WATANABE; Mitsuhisa ;   et al. | 2009-01-15 |
Semiconductor storage device having a plurality of stacked memory chips Grant 7,466,577 - Sekiguchi , et al. December 16, 2 | 2008-12-16 |
Semiconductor device and manufacturing method thereof Grant 7,378,333 - Satoh , et al. May 27, 2 | 2008-05-27 |
DRAM stacked package, DIMM, and semiconductor manufacturing method App 20060239055 - Sonoda; Yuji ;   et al. | 2006-10-26 |
Semiconductor storage device having a plurality of stacked memory chips App 20060233012 - Sekiguchi; Tomonori ;   et al. | 2006-10-19 |
Semiconductor device Grant 7,119,428 - Tanie , et al. October 10, 2 | 2006-10-10 |
Semiconductor device and method for producing the same Grant 7,057,283 - Inoue , et al. June 6, 2 | 2006-06-06 |
Integrated circuit device having reduced substrate size and a method for manufacturing the same Grant 6,989,600 - Kubo , et al. January 24, 2 | 2006-01-24 |
Semiconductor device and manufacturing method thereof App 20050245061 - Satoh, Toshiya ;   et al. | 2005-11-03 |
BGA semiconductor device having a dummy bump App 20050230824 - Watanabe, Yuji ;   et al. | 2005-10-20 |
Method of manufacturing a semiconductor integrated circuit device Grant 6,949,416 - Miyamoto , et al. September 27, 2 | 2005-09-27 |
Semiconductor device and manufacturing method thereof Grant 6,946,723 - Satoh , et al. September 20, 2 | 2005-09-20 |
Semiconductor device and manufacturing method of that Grant 6,946,327 - Miyamoto , et al. September 20, 2 | 2005-09-20 |
Semiconductor module and mounting method for same Grant 6,940,162 - Eguchi , et al. September 6, 2 | 2005-09-06 |
Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure Grant 6,930,388 - Yamaguchi , et al. August 16, 2 | 2005-08-16 |
Semiconductor device Grant 6,919,622 - Murakami , et al. July 19, 2 | 2005-07-19 |
Wafer level chip size package having rerouting layers Grant 6,861,742 - Miyamoto , et al. March 1, 2 | 2005-03-01 |
Semiconductor module and mounting method for same App 20040251540 - Eguchi, Shuji ;   et al. | 2004-12-16 |
Semiconductor apparatus including insulating layer having a protrusive portion Grant 6,822,317 - Inoue , et al. November 23, 2 | 2004-11-23 |
Semiconductor integrated circuit device and method of manufacturing the same App 20040227254 - Miyamoto, Toshio ;   et al. | 2004-11-18 |
Semiconductor device and method for producing the same App 20040195687 - Inoue, Kosuke ;   et al. | 2004-10-07 |
Semiconductor module and mounting method for same Grant 6,784,541 - Eguchi , et al. August 31, 2 | 2004-08-31 |
Semiconductor device and manufacturing method of that App 20040155351 - Miyamoto, Toshio ;   et al. | 2004-08-12 |
Semiconductor device App 20040155323 - Murakami, Gen ;   et al. | 2004-08-12 |
Method for producing a semiconductor device Grant 6,770,547 - Inoue , et al. August 3, 2 | 2004-08-03 |
Semiconductor device Grant 6,720,208 - Murakami , et al. April 13, 2 | 2004-04-13 |
Semiconductor integrated circuit device Grant 6,720,591 - Miyamoto , et al. April 13, 2 | 2004-04-13 |
Semiconductor device and its manufacturing method App 20030207557 - Akiyama, Yukiharu ;   et al. | 2003-11-06 |
Semiconductor device and its manufacturing method Grant 6,639,323 - Akiyama , et al. October 28, 2 | 2003-10-28 |
Semiconductor module and method of mounting Grant 6,627,997 - Eguchi , et al. September 30, 2 | 2003-09-30 |
Semiconductor device and method for manufacturing the same Grant 6,624,504 - Inoue , et al. September 23, 2 | 2003-09-23 |
Semiconductor device and mounting board Grant 6,621,160 - Shibamoto , et al. September 16, 2 | 2003-09-16 |
Semiconductor apparatus having stress cushioning layer Grant 6,621,154 - Satoh , et al. September 16, 2 | 2003-09-16 |
Integrated circuit and method of manufacturing thereof App 20030148558 - Kubo, Masaharu ;   et al. | 2003-08-07 |
Semiconductor device App 20030127712 - Murakami, Gen ;   et al. | 2003-07-10 |
Semiconductor module and mounting method for same App 20030071348 - Eguchi, Shuji ;   et al. | 2003-04-17 |
Semiconductor device with elastic structure and wiring Grant 6,515,371 - Akiyama , et al. February 4, 2 | 2003-02-04 |
Semiconductor integrated circuit device and method of manufacturing the same App 20020153539 - Miyamoto, Toshio ;   et al. | 2002-10-24 |
Semiconductor device, manufacturing method thereof and mounting board App 20020105070 - Shibamoto, Masanori ;   et al. | 2002-08-08 |
Semiconductor device and manufacturing method of that App 20020093082 - Miyamoto, Toshio ;   et al. | 2002-07-18 |
Semiconductor device, manufacturing method thereof and mounting board Grant 6,404,049 - Shibamoto , et al. June 11, 2 | 2002-06-11 |
Semiconductor device, manufacturing method thereof and mounting board App 20020066955 - Shibamoto, Masanori ;   et al. | 2002-06-06 |
Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure App 20020063332 - Yamaguchi, Yoshihide ;   et al. | 2002-05-30 |
Semiconductor device and its manufacturing method App 20020050636 - Akiyama, Yukiharu ;   et al. | 2002-05-02 |
Semiconductor device and its manufacturing method App 20020047215 - Akiyama, Yukiharu ;   et al. | 2002-04-25 |
Semiconductor device and manufacturing method thereof App 20020025655 - Satoh, Toshiya ;   et al. | 2002-02-28 |
Semiconductor device App 20010008302 - Murakami, Gen ;   et al. | 2001-07-19 |
Semiconductor device having all outer leads extending from one side of a resin member Grant 6,100,580 - Murakami , et al. August 8, 2 | 2000-08-08 |
Semiconductor device chip on lead and lead on chip manufacturing Grant 6,069,029 - Murakami , et al. May 30, 2 | 2000-05-30 |
Semiconductor device Grant 5,068,712 - Murakami , et al. November 26, 1 | 1991-11-26 |
Resin molded semiconductor device Grant 4,974,054 - Anjo November 27, 1 | 1990-11-27 |
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