loadpatents
name:-0.037261962890625
name:-0.037845849990845
name:-0.00067901611328125
Anjo; Ichiro Patent Filings

Anjo; Ichiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Anjo; Ichiro.The latest application filed is for "bga semiconductor device having a dummy bump".

Company Profile
0.32.24
  • Anjo; Ichiro - Tokyo JP
  • Anjo; Ichiro - Koganei JP
  • Anjo; Ichiro - Koganel JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
BGA semiconductor device having a dummy bump
Grant 8,222,737 - Watanabe , et al. July 17, 2
2012-07-17
BGA semiconductor device having a dummy bump
Grant 8,164,186 - Watanabe , et al. April 24, 2
2012-04-24
Bga Semiconductor Device Having A Dummy Bump
App 20100295179 - Watanabe; Yuji ;   et al.
2010-11-25
Semiconductor package with reduced length interconnect and manufacturing method thereof
Grant 7,812,439 - Watanabe , et al. October 12, 2
2010-10-12
DRAM stacked package, DIMM, and semiconductor manufacturing method
Grant 7,546,506 - Sonoda , et al. June 9, 2
2009-06-09
Semiconductor Apparatus And Manufacturing Method Of Semiconductor Apparatus
App 20090014874 - WATANABE; Mitsuhisa ;   et al.
2009-01-15
Semiconductor storage device having a plurality of stacked memory chips
Grant 7,466,577 - Sekiguchi , et al. December 16, 2
2008-12-16
Semiconductor device and manufacturing method thereof
Grant 7,378,333 - Satoh , et al. May 27, 2
2008-05-27
DRAM stacked package, DIMM, and semiconductor manufacturing method
App 20060239055 - Sonoda; Yuji ;   et al.
2006-10-26
Semiconductor storage device having a plurality of stacked memory chips
App 20060233012 - Sekiguchi; Tomonori ;   et al.
2006-10-19
Semiconductor device
Grant 7,119,428 - Tanie , et al. October 10, 2
2006-10-10
Semiconductor device and method for producing the same
Grant 7,057,283 - Inoue , et al. June 6, 2
2006-06-06
Integrated circuit device having reduced substrate size and a method for manufacturing the same
Grant 6,989,600 - Kubo , et al. January 24, 2
2006-01-24
Semiconductor device and manufacturing method thereof
App 20050245061 - Satoh, Toshiya ;   et al.
2005-11-03
BGA semiconductor device having a dummy bump
App 20050230824 - Watanabe, Yuji ;   et al.
2005-10-20
Method of manufacturing a semiconductor integrated circuit device
Grant 6,949,416 - Miyamoto , et al. September 27, 2
2005-09-27
Semiconductor device and manufacturing method thereof
Grant 6,946,723 - Satoh , et al. September 20, 2
2005-09-20
Semiconductor device and manufacturing method of that
Grant 6,946,327 - Miyamoto , et al. September 20, 2
2005-09-20
Semiconductor module and mounting method for same
Grant 6,940,162 - Eguchi , et al. September 6, 2
2005-09-06
Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure
Grant 6,930,388 - Yamaguchi , et al. August 16, 2
2005-08-16
Semiconductor device
Grant 6,919,622 - Murakami , et al. July 19, 2
2005-07-19
Wafer level chip size package having rerouting layers
Grant 6,861,742 - Miyamoto , et al. March 1, 2
2005-03-01
Semiconductor module and mounting method for same
App 20040251540 - Eguchi, Shuji ;   et al.
2004-12-16
Semiconductor apparatus including insulating layer having a protrusive portion
Grant 6,822,317 - Inoue , et al. November 23, 2
2004-11-23
Semiconductor integrated circuit device and method of manufacturing the same
App 20040227254 - Miyamoto, Toshio ;   et al.
2004-11-18
Semiconductor device and method for producing the same
App 20040195687 - Inoue, Kosuke ;   et al.
2004-10-07
Semiconductor module and mounting method for same
Grant 6,784,541 - Eguchi , et al. August 31, 2
2004-08-31
Semiconductor device and manufacturing method of that
App 20040155351 - Miyamoto, Toshio ;   et al.
2004-08-12
Semiconductor device
App 20040155323 - Murakami, Gen ;   et al.
2004-08-12
Method for producing a semiconductor device
Grant 6,770,547 - Inoue , et al. August 3, 2
2004-08-03
Semiconductor device
Grant 6,720,208 - Murakami , et al. April 13, 2
2004-04-13
Semiconductor integrated circuit device
Grant 6,720,591 - Miyamoto , et al. April 13, 2
2004-04-13
Semiconductor device and its manufacturing method
App 20030207557 - Akiyama, Yukiharu ;   et al.
2003-11-06
Semiconductor device and its manufacturing method
Grant 6,639,323 - Akiyama , et al. October 28, 2
2003-10-28
Semiconductor module and method of mounting
Grant 6,627,997 - Eguchi , et al. September 30, 2
2003-09-30
Semiconductor device and method for manufacturing the same
Grant 6,624,504 - Inoue , et al. September 23, 2
2003-09-23
Semiconductor device and mounting board
Grant 6,621,160 - Shibamoto , et al. September 16, 2
2003-09-16
Semiconductor apparatus having stress cushioning layer
Grant 6,621,154 - Satoh , et al. September 16, 2
2003-09-16
Integrated circuit and method of manufacturing thereof
App 20030148558 - Kubo, Masaharu ;   et al.
2003-08-07
Semiconductor device
App 20030127712 - Murakami, Gen ;   et al.
2003-07-10
Semiconductor module and mounting method for same
App 20030071348 - Eguchi, Shuji ;   et al.
2003-04-17
Semiconductor device with elastic structure and wiring
Grant 6,515,371 - Akiyama , et al. February 4, 2
2003-02-04
Semiconductor integrated circuit device and method of manufacturing the same
App 20020153539 - Miyamoto, Toshio ;   et al.
2002-10-24
Semiconductor device, manufacturing method thereof and mounting board
App 20020105070 - Shibamoto, Masanori ;   et al.
2002-08-08
Semiconductor device and manufacturing method of that
App 20020093082 - Miyamoto, Toshio ;   et al.
2002-07-18
Semiconductor device, manufacturing method thereof and mounting board
Grant 6,404,049 - Shibamoto , et al. June 11, 2
2002-06-11
Semiconductor device, manufacturing method thereof and mounting board
App 20020066955 - Shibamoto, Masanori ;   et al.
2002-06-06
Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure
App 20020063332 - Yamaguchi, Yoshihide ;   et al.
2002-05-30
Semiconductor device and its manufacturing method
App 20020050636 - Akiyama, Yukiharu ;   et al.
2002-05-02
Semiconductor device and its manufacturing method
App 20020047215 - Akiyama, Yukiharu ;   et al.
2002-04-25
Semiconductor device and manufacturing method thereof
App 20020025655 - Satoh, Toshiya ;   et al.
2002-02-28
Semiconductor device
App 20010008302 - Murakami, Gen ;   et al.
2001-07-19
Semiconductor device having all outer leads extending from one side of a resin member
Grant 6,100,580 - Murakami , et al. August 8, 2
2000-08-08
Semiconductor device chip on lead and lead on chip manufacturing
Grant 6,069,029 - Murakami , et al. May 30, 2
2000-05-30
Semiconductor device
Grant 5,068,712 - Murakami , et al. November 26, 1
1991-11-26
Resin molded semiconductor device
Grant 4,974,054 - Anjo November 27, 1
1990-11-27

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