loadpatents
name:-0.0025138854980469
name:-0.016572952270508
name:-0.0027799606323242
Ang; Boon Y. Patent Filings

Ang; Boon Y.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ang; Boon Y..The latest application filed is for "method of testing a semiconductor structure".

Company Profile
2.12.1
  • Ang; Boon Y. - Sunnyvale CA
  • Ang; Boon Y. - Cupertino CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Mixed storage of data fields
Grant 11,379,580 - Wesselkamper , et al. July 5, 2
2022-07-05
Test vehicle for package testing
Grant 11,073,550 - Gong , et al. July 27, 2
2021-07-27
Systems and methods for on-die heat generation and temperature sensing
Grant 10,620,644 - Parameswaran , et al.
2020-04-14
On-die temperature sensing and digitization system
Grant 10,302,504 - Parameswaran , et al.
2019-05-28
Circuit for and method of testing bond connections between a first die and a second die
Grant 10,262,911 - Gong , et al.
2019-04-16
Method of testing a semiconductor structure
Grant 8,810,269 - Gong , et al. August 19, 2
2014-08-19
Method Of Testing A Semiconductor Structure
App 20140091819 - Gong; Yuqing ;   et al.
2014-04-03
Contact fuse one time programmable memory
Grant 8,143,695 - Ang , et al. March 27, 2
2012-03-27
Electrically programmable diffusion fuse
Grant 8,102,019 - Tumakha , et al. January 24, 2
2012-01-24
Method of fabricating CMOS-compatible non-volatile memory cell with lateral inter-poly programming layer
Grant 7,839,693 - Paak , et al. November 23, 2
2010-11-23
Method and system for locating chip-level defects through emission imaging of a semiconductor device
Grant 6,995,564 - Ang , et al. February 7, 2
2006-02-07
Method and apparatus for identifying individual die during failure analysis
Grant 6,830,941 - Lee , et al. December 14, 2
2004-12-14
Method for revealing active regions in a SOI structure for DUT backside inspection
Grant 6,770,495 - Ang , et al. August 3, 2
2004-08-03

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