Ang; Bernie Chrisanto
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ang; Bernie Chrisanto.The latest application filed is for "packaged ic devices and associated ic device packaging methods".
- Ang; Bernie Chrisanto - Batangas PH
- ANG; BERNIE CHRISANTO - STO. TOMAS PH
- ANG; Bernie Chrisanto - Santo Tomas PH
| Patent | Date |
|---|---|
| Enhanced flip-chip die architecture Grant 9,177,903 - Ang , et al. November 3, 2 | 2015-11-03 |
| Packaged Ic Devices And Associated Ic Device Packaging Methods App 20150179477 - CADAG; AARON ; et al. | 2015-06-25 |
| Method and system for determining and dispensing resin for a compression molding process flow Grant 9,011,127 - Carino , et al. April 21, 2 | 2015-04-21 |
| Enhanced Flip-chip Die Architecture App 20140291842 - ANG; Bernie Chrisanto ; et al. | 2014-10-02 |
| Method And System For Determining And Dispensing Resin For A Compression Molding Process Flow App 20140048976 - Carino; Wiljee ; et al. | 2014-02-20 |
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