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Patent applications and USPTO patent grants for Andryushchenko; Tatyana N..The latest application filed is for "stretchable electronics fabrication method with strain redistribution layer".
Patent | Date |
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Stretchable electronics fabrication method with strain redistribution layer Grant 10,468,357 - Dias , et al. No | 2019-11-05 |
Gradient encapsulant protection of devices in stretchable electronics Grant 10,206,277 - Dias , et al. Feb | 2019-02-12 |
Stretchable Electronics Fabrication Method With Strain Redistribution Layer App 20180019213 - DIAS; Rajendra C. ;   et al. | 2018-01-18 |
Gradient Encapsulant Protection Of Devices In Stretchable Electronics App 20170181275 - Dias; Rajendra C. ;   et al. | 2017-06-22 |
Method for forming planarizing copper in a low-k dielectric Grant 7,585,760 - Andryushchenko , et al. September 8, 2 | 2009-09-08 |
Chemical dissolution of barrier and adhesion layers Grant 7,560,380 - Andryushchenko , et al. July 14, 2 | 2009-07-14 |
Ultrasonic electropolishing of conductive material App 20080213995 - Andryushchenko; Tatyana N. ;   et al. | 2008-09-04 |
Chemical dissolution of barrier and adhesion layers App 20080102631 - Andryushchenko; Tatyana N. ;   et al. | 2008-05-01 |
Method for forming planarizing copper in a low-k dielectric App 20070298605 - Andryushchenko; Tatyana N. ;   et al. | 2007-12-27 |
Method for copper damascence fill for forming an interconnect App 20070298607 - Andryushchenko; Tatyana N. ;   et al. | 2007-12-27 |
Novel chemical composition to reduce defects App 20070228011 - Buehler; Mark F. ;   et al. | 2007-10-04 |
Reducing aluminum dissolution in high pH solutions App 20070152252 - Buehler; Mark F. ;   et al. | 2007-07-05 |
Damascene fabrication with electrochemical layer removal Grant 7,223,685 - Andryushchenko , et al. May 29, 2 | 2007-05-29 |
Damascene fabrication with electrochemical layer removal App 20050003637 - Andryushchenko, Tatyana N. ;   et al. | 2005-01-06 |
Damascene fabrication with electrochemical layer removal App 20040256224 - Andryushchenko, Tatyana N. ;   et al. | 2004-12-23 |
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