Andros; Frank E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Andros; Frank E..The latest application filed is for "structure for removably attaching a heat sink to surface mount packages".

Company Profile

0.8.0

Andros; Frank E. - Binghampton NY
Andros; Frank E. - Binghamton NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structure for removably attaching a heat sink to surface mount packages Grant 6,219,238 - Andros , et al. April 17, 2	2001-04-17
Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto Grant 5,633,533 - Andros , et al. May 27, 1	1997-05-27
Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto Grant 5,561,323 - Andros , et al. October 1, 1	1996-10-01
Method of making an electronic package with a thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto Grant 5,519,936 - Andros , et al. May 28, 1	1996-05-28
Electronic package structure and method of making same Grant 5,367,435 - Andros , et al. November 22, 1	1994-11-22
Micro helix thermo capsule Grant 4,313,492 - Andros , et al. February 2, 1	1982-02-02
Air-cooled hybrid electronic package Grant 4,291,364 - Andros , et al. September 22, 1	1981-09-22
Micro bellows thermo capsule Grant 4,212,349 - Andros , et al. July 15, 1	1980-07-15

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