Andricacos; Panayotis
Patent Applications and Registrations
Patent applications and USPTO patent grants for Andricacos; Panayotis.The latest application filed is for "structure comprising a barrier layer of a tungsten alloy comprising cobalt and/or nickel".
- Andricacos; Panayotis - Croton-on-Hudson NY
- Andricacos; Panayotis - Yorktown Heights NY
- Andricacos; Panayotis - Chicago IL
| Patent | Date |
|---|---|
| Void-free damascene copper deposition process and means of monitoring thereof Grant 7,678,258 - Andricacos , et al. March 16, 2 | 2010-03-16 |
| Method of forming noble metal contacts Grant 7,581,314 - Deligianni , et al. September 1, 2 | 2009-09-01 |
| Plating apparatus and plating method Grant 7,553,400 - Nagai , et al. June 30, 2 | 2009-06-30 |
| Structure Comprising A Barrier Layer Of A Tungsten Alloy Comprising Cobalt And/or Nickel App 20080237053 - Andricacos; Panayotis ; et al. | 2008-10-02 |
| Noble metal contacts for micro-electromechanical switches Grant 7,202,764 - Deligianni , et al. April 10, 2 | 2007-04-10 |
| Apparatus for direct plating on resistive liners App 20060163055 - Vereecken; Philippe M. ; et al. | 2006-07-27 |
| Noble metal contacts for micro-electromechanical switches App 20060164194 - Deligianni; Hariklia ; et al. | 2006-07-27 |
| Deep filled vias Grant 7,060,624 - Andricacos , et al. June 13, 2 | 2006-06-13 |
| Method for electroplating on resistive substrates Grant 6,974,531 - Andricacos , et al. December 13, 2 | 2005-12-13 |
| Field effect transistor with electroplated metal gate Grant 6,967,131 - Saenger , et al. November 22, 2 | 2005-11-22 |
| Plating apparatus and plating method App 20050241946 - Nagai, Mizuki ; et al. | 2005-11-03 |
| Method for electroplating on resistive substrates App 20050199502 - Andricacos, Panayotis ; et al. | 2005-09-15 |
| Field effect transistor with electroplated metal gate App 20050095852 - Saenger, Katherine L. ; et al. | 2005-05-05 |
| Deep filled vias App 20050037608 - Andricacos, Panayotis ; et al. | 2005-02-17 |
| Noble Metal Contacts For Micro-electromechanical Switches App 20050007217 - Deligianni, Hariklia ; et al. | 2005-01-13 |
| Void-free damascene copper deposition process and means of monitoring thereof App 20050006242 - Andricacos, Panayotis ; et al. | 2005-01-13 |
| Structure comprising a barrier layer of a tungsten alloy comprising cobalt and/or nickel App 20040108136 - Andricacos, Panayotis ; et al. | 2004-06-10 |
| Method for electroplating on resistive substrates App 20040069648 - Andricacos, Panayotis ; et al. | 2004-04-15 |
| MEMS RF switch with low actuation voltage Grant 6,639,488 - Deligianni , et al. October 28, 2 | 2003-10-28 |
| MEMS RF switch with low actuation voltage App 20030048149 - Deligianni, Hariklia ; et al. | 2003-03-13 |
| Method for depositing copper onto a barrier layer Grant 6,416,812 - Andricacos , et al. July 9, 2 | 2002-07-09 |
| Copper seed layer repair technique using electroless touch-up Grant 6,395,164 - Andricacos , et al. May 28, 2 | 2002-05-28 |
| Capacitor formed with Pt electrodes having a 3D cup-like shape with roughened inner and outer surfaces Grant 6,323,127 - Andricacos , et al. November 27, 2 | 2001-11-27 |
| Multi-compartment eletroplating system Grant 5,312,532 - Andricacos , et al. May 17, 1 | 1994-05-17 |
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