ANDO; Yoshio

Patent Applications and Registrations

Patent applications and USPTO patent grants for ANDO; Yoshio.The latest application filed is for "computer system, program, and method for providing advice on communication".

Company Profile

1.17.10

ANDO; Yoshio - Tokyo JP
Ando; Yoshio - Aichi JP
Ando; Yoshio - Shizuoka-ken JP
Ando; Yoshio - Shiga JP
Ando, Yoshio - Koka-gun JP
Ando; Yoshio - Kanagawa-ken JP
Ando; Yoshio - Chigasaki JP
Ando; Yoshio - Kawagoe JP
Ando; Yoshio - Fujisawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Computer System, Program, And Method For Providing Advice On Communication App 20220114520 - HONDA; Hidetaka ; et al.	2022-04-14
Computer System, Program, And Method For Providing Advice On Communication App 20210192403 - HONDA; Hidetaka ; et al.	2021-06-24
Exhaust passage component Grant 8,678,027 - Ando , et al. March 25, 2	2014-03-25
Exhaust Passage Component App 20120138163 - ANDO; Yoshio ; et al.	2012-06-07
Heat Exchanger App 20110042039 - Ando; Yoshio ; et al.	2011-02-24
Heat Exchanger App 20110042048 - Ando; Yoshio	2011-02-24
Process for preparing nicotinamide adenine dinucleotide phosphate(NADP) Grant 7,863,014 - Kawai , et al. January 4, 2	2011-01-04
Spacer, Fixing Structure And Heat Exchanger App 20100326639 - Ando; Yoshio	2010-12-30
Outboard-type generator Grant 7,320,628 - Ando January 22, 2	2008-01-22
Outboard-type generator App 20060234566 - Ando; Yoshio	2006-10-19
Process for producing nicotinamide adenine dinucleotide phosphate(nadp) App 20040248263 - Kawai, Shigeyuki ; et al.	2004-12-09
Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for TAB, adhesive-backed tape for wire bonding connection, semiconductor connecting substrate and semiconductor device Grant 6,716,529 - Sawamura , et al. April 6, 2	2004-04-06
Paint manufacturing method App 20020138294 - Ando, Yoshio ; et al.	2002-09-26
Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for TAB, adhesive-backed tape for wire bonding connection, semiconductor connecting substrate, and semiconductor device App 20020025431 - Sawamura, Yasushi ; et al.	2002-02-28
Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for tab, adhesive-backed tape for wire-bonding connection, semiconductor connecting substrate, and semiconductor device Grant 6,303,219 - Sawamura , et al. October 16, 2	2001-10-16
Process for preparing grain product Grant 5,853,779 - Takebe , et al. December 29, 1	1998-12-29
Method and apparatus for evacuating vacuum system Grant 5,746,581 - Okumura , et al. May 5, 1	1998-05-05
Image processing system Grant 5,073,965 - Konishi , et al. December 17, 1	1991-12-17
Image processing system Grant 4,878,250 - Kotera , et al. October 31, 1	1989-10-31
Image processing system Grant 4,769,852 - Hashimoto , et al. September 6, 1	1988-09-06
Image processing system Grant 4,658,299 - Tanaka , et al. April 14, 1	1987-04-14
Apparatus for producing a molded skin product Grant 4,601,652 - Ando , et al. July 22, 1	1986-07-22
Process for producing a molded skin product Grant 4,552,715 - Ando , et al. November 12, 1	1985-11-12
Apparatus for retrieving information Grant 4,514,641 - Tanaka , et al. April 30, 1	1985-04-30
Process of manufacturing a heat-resistant composite sheet Grant 4,224,376 - Ishige , et al. September 23, 1	1980-09-23
Method and apparatus for optical method of measuring rail displacement Grant 4,181,430 - Shirota , et al. January 1, 1	1980-01-01

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.