Ando; Setsuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ando; Setsuo.The latest application filed is for "crimping terminal and electric wire with crimping terminal".

Company Profile

2.4.4

Ando; Setsuo - Hitachi JP
Ando; Setsuo - Saitama-ken JP
Ando; Setsuo - Kawasaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Refined copper, method of producing refined copper, electric wire and method of manufacturing electric wire Grant 10,597,790 - Suenaga , et al.	2020-03-24
Crimping terminal and electric wire with crimping terminal Grant 10,312,604 - Suenaga , et al.	2019-06-04
Crimping Terminal And Electric Wire With Crimping Terminal App 20180358712 - SUENAGA; Kazufumi ; et al.	2018-12-13
Refined Copper, Method Of Producing Refined Copper, Electric Wire And Method Of Manufacturing Electric Wire App 20170327961 - SUENAGA; Kazufumi ; et al.	2017-11-16
Electrolytic copper-plated R-T-B magnet and plating method thereof Grant 6,866,765 - Ando , et al. March 15, 2	2005-03-15
Electrolytic copper-plated r-t-b magnet and plating method thereof App 20030052013 - Ando, Setsuo ; et al.	2003-03-20
Coated r-t-b magnet and method for preparation thereof App 20030041920 - Hoshi, Hiroyuki ; et al.	2003-03-06
Electronic device plated with gold by means of an electroless gold plating solution Grant 4,963,974 - Ushio , et al. October 16, 1	1990-10-16

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