| Patent | Date |
|---|
Integrated Circuit (ic) Package With Embedded Heat Spreader In A Redistribution Layer (rdl)
App 20210183722 - Anderson; Kevin J. ; et al. | 2021-06-17 |
Laminate-based package with internal overmold
Grant 10,390,434 - Anderson , et al. A | 2019-08-20 |
Laminate-based Package With Internal Overmold
App 20190116670 - Anderson; Kevin J. ; et al. | 2019-04-18 |
Air-cavity package with enhanced package integration level and thermal performance
Grant 10,217,686 - Meliane , et al. Feb | 2019-02-26 |
Air-cavity package with dual signal-transition sides
Grant 10,217,685 - Anderson , et al. Feb | 2019-02-26 |
Air cavity package
Grant 10,177,064 - Anderson , et al. J | 2019-01-08 |
Air-cavity Package With Enhanced Package Integration Level And Thermal Performance
App 20180218955 - Meliane; Walid M. ; et al. | 2018-08-02 |
Air-cavity Package With Dual Signal-transition Sides
App 20180197800 - Anderson; Kevin J. ; et al. | 2018-07-12 |
Air-cavity package with enhanced package integration level and thermal performance
Grant 9,991,181 - Meliane , et al. June 5, 2 | 2018-06-05 |
Air-cavity package with two heat dissipation interfaces
Grant 9,974,158 - Railkar , et al. May 15, 2 | 2018-05-15 |
Air-cavity package with dual signal-transition sides
Grant 9,935,026 - Anderson , et al. April 3, 2 | 2018-04-03 |
Air-cavity Package With Two Heat Dissipation Interfaces
App 20180063940 - Railkar; Tarak A. ; et al. | 2018-03-01 |
Air Cavity Package
App 20180061730 - Anderson; Kevin J. ; et al. | 2018-03-01 |
Air-cavity Package With Enhanced Package Integration Level And Thermal Performance
App 20180061725 - Meliane; Walid M. ; et al. | 2018-03-01 |
Air-cavity Package With Dual Signal-transition Sides
App 20180061726 - Anderson; Kevin J. ; et al. | 2018-03-01 |
Semiconductor package with lid having lid conductive structure
Grant 9,799,637 - Balut , et al. October 24, 2 | 2017-10-24 |
Hollow-cavity flip-chip package with reinforced interconnects and process for making the same
Grant 9,793,237 - Railkar , et al. October 17, 2 | 2017-10-17 |
Semiconductor Package With Lid Having Lid Conductive Structure
App 20170236808 - Balut; Brian P. ; et al. | 2017-08-17 |
Apparatuses, systems, and methods for die attach coatings for semiconductor packages
Grant 9,659,898 - Railkar , et al. May 23, 2 | 2017-05-23 |
Hollow-cavity Flip-chip Package With Reinforced Interconnects And Process For Making The Same
App 20170110434 - Railkar; Tarak A. ; et al. | 2017-04-20 |
Absorbent pad for use with animal caging systems
Grant 8,826,861 - Kuzniar , et al. September 9, 2 | 2014-09-09 |
Absorbent Pad For Use With Animal Caging Systems
App 20140196666 - Kuzniar; Russell F. ; et al. | 2014-07-17 |
Vehicle washing machine
Grant 6,202,244 - Anderson March 20, 2 | 2001-03-20 |
Vehicle washing machine
Grant 5,979,002 - Anderson November 9, 1 | 1999-11-09 |
System and method for maintaining plural driven components at reference positions
Grant 5,492,067 - Anderson February 20, 1 | 1996-02-20 |
Single balanced self-oscillating dual gate FET mixer
Grant 4,658,440 - Pavio , et al. April 14, 1 | 1987-04-14 |
| 