| Patent | Date |
|---|
Ultralow-k Dielectric-gap Wrapped Contacts And Method
App 20220189818 - Al-Amoody; Fuad H. ; et al. | 2022-06-16 |
Method for forming BEOL metal levels with multiple dielectric layers for improved dielectric to metal adhesion
Grant 10,163,697 - Anderson , et al. Dec | 2018-12-25 |
Structure For Beol Metal Levels With Multiple Dielectric Layers For Improved Dielectric To Metal Adhesion
App 20170207121 - Anderson; Felix P. ; et al. | 2017-07-20 |
Structure for BEOL metal levels with multiple dielectric layers for improved dielectric to metal adhesion
Grant 9,673,091 - Anderson , et al. June 6, 2 | 2017-06-06 |
Metal Level Formation Method And An Integrated Circuit Structure Having A Metal Level With Improved Dielectric To Metal Adhesion
App 20160379878 - Anderson; Felix P. ; et al. | 2016-12-29 |
Integrated circuit switches, design structure and methods of fabricating the same
Grant 9,284,185 - Anderson , et al. March 15, 2 | 2016-03-15 |
Methods Of Manufacturing Semiconductor Devices And A Semiconductor Structure
App 20150130064 - ANDERSON; Felix P. ; et al. | 2015-05-14 |
Methods of manufacturing semiconductor devices and a semiconductor structure
Grant 8,969,195 - Anderson , et al. March 3, 2 | 2015-03-03 |
System and method for forming an aluminum fuse for compatibility with copper BEOL interconnect scheme
Grant 8,927,411 - Anderson , et al. January 6, 2 | 2015-01-06 |
System and method for forming aluminum fuse for compatibility with copper BEOL interconnect scheme
Grant 8,921,975 - Anderson , et al. December 30, 2 | 2014-12-30 |
System and method for forming aluminum fuse for compatibility with copper BEOL interconnect scheme
Grant 08921975 - | 2014-12-30 |
Horizontal coplanar switches and methods of manufacture
Grant 8,878,315 - Anderson , et al. November 4, 2 | 2014-11-04 |
Vertical integrated circuit switches, design structure and methods of fabricating same
Grant 8,791,778 - Anderson , et al. July 29, 2 | 2014-07-29 |
System And Method For Forming An Aluminum Fuse For Compatibility With Copper Beol Interconnect Scheme
App 20140106559 - Anderson; Felix P. ; et al. | 2014-04-17 |
Vertical Integrated Circuit Switches, Design Structure and Methods of Fabricating Same
App 20140014480 - ANDERSON; Felix P. ; et al. | 2014-01-16 |
Integrated Circuit Switches, Design Structure And Methods Of Fabricating The Same
App 20140017844 - ANDERSON; Felix P. ; et al. | 2014-01-16 |
Vertical integrated circuit switches, design structure and methods of fabricating same
Grant 8,604,898 - Anderson , et al. December 10, 2 | 2013-12-10 |
System And Method For Forming Aluminum Fuse For Compatibility With Copper Beol Interconnect Scheme
App 20130320488 - Anderson; Felix P. ; et al. | 2013-12-05 |
Integrated circuit switches, design structure and methods of fabricating the same
Grant 8,569,091 - Anderson , et al. October 29, 2 | 2013-10-29 |
Horizontal coplanar switches and methods of manufacture
Grant 8,535,966 - Anderson , et al. September 17, 2 | 2013-09-17 |
Method of electrolytic plating and semiconductor device fabrication
Grant 8,518,817 - Anderson , et al. August 27, 2 | 2013-08-27 |
Horizontal Coplanar Switches And Methods Of Manufacture
App 20130153378 - ANDERSON; Felix P. ; et al. | 2013-06-20 |
Structures and methods for improving solder bump connections in semiconductor devices
Grant 8,293,634 - Anderson , et al. October 23, 2 | 2012-10-23 |
Reinforced Via Farm Interconnect Structure, A Method Of Forming A Reinforced Via Farm Interconnect Structure And A Method Of Redesigning An Integrated Circuit Chip To Include Such A Reinforced Via Farm Interconnect Structure
App 20120261813 - Anderson; Felix P. ; et al. | 2012-10-18 |
Structures And Methods For Improving Solder Bump Connections In Semiconductor Devices
App 20120129336 - ANDERSON; Felix P. ; et al. | 2012-05-24 |
Method Of Electrolytic Plating And Semiconductor Device Fabrication
App 20120070979 - Anderson; Felix P. ; et al. | 2012-03-22 |
Horizontal Coplanar Switches And Methods Of Manufacture
App 20120025331 - ANDERSON; Felix P. ; et al. | 2012-02-02 |
Wiring Structure And Method
App 20110127673 - Anderson; Felix P. ; et al. | 2011-06-02 |
Integrated Circuit Switches, Design Structure And Methods Of Fabricating The Same
App 20110049649 - ANDERSON; Felix P. ; et al. | 2011-03-03 |
CMP methods avoiding edge erosion and related wafer
Grant 7,833,907 - Anderson , et al. November 16, 2 | 2010-11-16 |
Vertical Integrated Circuit Switches, Design Structure And Methods Of Fabricating Same
App 20100263998 - Anderson; Felix P. ; et al. | 2010-10-21 |
Structures And Methods For Improving Solder Bump Connections In Semiconductor Devices
App 20100032829 - Anderson; Felix P. ; et al. | 2010-02-11 |
Curvilinear Wiring Structure To Reduce Areas Of High Field Density In An Integrated Circuit
App 20090288869 - Anderson; Felix P. ; et al. | 2009-11-26 |
Cmp Methods Avoiding Edge Erosion And Related Wafer
App 20090267192 - Anderson; Felix P. ; et al. | 2009-10-29 |
Methods Of Manufacturing Semiconductor Devices And A Semiconductor Structure
App 20090212434 - Anderson; Felix P. ; et al. | 2009-08-27 |
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