AN; Sang-Ho

Patent Applications and Registrations

Patent applications and USPTO patent grants for AN; Sang-Ho.The latest application filed is for "composition for cleaning mask and method for cleaning mask using the same".

Company Profile

1.10.18

AN; Sang-Ho - Seongnam-si KR
An; Sang-Ho - Suwon-si KR
An; Sang-Ho - Kyunggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Composition For Cleaning Mask And Method For Cleaning Mask Using The Same App 20200017978 - LEE; Gil Ho ; et al.	2020-01-16
Semiconductor package including stacked semiconductor chips and a redistribution layer Grant 9,496,216 - Chun , et al. November 15, 2	2016-11-15
Semiconductor package Grant 9,379,062 - Jeong , et al. June 28, 2	2016-06-28
Semiconductor Package App 20150021787 - JEONG; Ki-hong ; et al.	2015-01-22
Solid state drive packages and related methods and systems Grant 8,838,885 - Kwak , et al. September 16, 2	2014-09-16
Substrates for semiconductor devices including internal shielding structures and semiconductor devices including the substrates Grant 8,791,554 - Kwak , et al. July 29, 2	2014-07-29
Semiconductor Package Including Stacked Semiconductor Chips and a Redistribution Layer App 20130161788 - Chun; Sung-Hoon ; et al.	2013-06-27
Substrates For Semiconductor Devices Including Internal Shielding Structures And Semiconductor Devices Including The Substrates App 20130020685 - KWAK; Dong-Ok ; et al.	2013-01-24
Solid State Drive Packages And Related Methods And Systems App 20120317332 - Kwak; Dong-ok ; et al.	2012-12-13
Semiconductor Package Including Decoupling Semiconductor Capacitor App 20120068306 - SONG; Sang-Sub ; et al.	2012-03-22
Semiconductor Package And Method Of Fabricating The Same App 20120061816 - SONG; Sang-Sub ; et al.	2012-03-15
Method and apparatus for bonding a wire Grant 7,371,675 - Kang , et al. May 13, 2	2008-05-13
Multi-chip package and method for manufacturing the same Grant 7,368,811 - Kang , et al. May 6, 2	2008-05-06
Package-on-package Structures App 20070252256 - Lim; Gwang-Man ; et al.	2007-11-01
Printed circuit board, semiconductor package and multi-stack semiconductor package using the same App 20070035009 - Hwang; Sung-wook ; et al.	2007-02-15
Semiconductor package having lead free conductive bumps and method of manufacturing the same App 20070001284 - Kim; Bo-Seong ; et al.	2007-01-04
Semiconductor chip stack package having dummy chip App 20060151865 - Han; Chang-Hoon ; et al.	2006-07-13
Multi-chip module having bonding wires and method of fabricating the same App 20060125093 - Kang; In-Ku ; et al.	2006-06-15
Multi-chip module having bonding wires and method of fabricating the same Grant 7,030,489 - Kang , et al. April 18, 2	2006-04-18
Multi-chip package and method for manufacturing the same App 20060071317 - Kang; In-Ku ; et al.	2006-04-06
Method and apparatus for bonding a wire App 20050200009 - Kang, In-Ku ; et al.	2005-09-15
Multi-chip module having bonding wires and method of fabricating the same App 20050023674 - Kang, In-Ku ; et al.	2005-02-03
Multi-chip packages having a plurality of flip chips and methods of manufacturing the same App 20040262774 - Kang, In-Ku ; et al.	2004-12-30

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