An; Jeong Hoon

Patent Applications and Registrations

Patent applications and USPTO patent grants for An; Jeong Hoon.The latest application filed is for "composition for coating photoresist pattern and method for forming fine pattern using the same".

Company Profile

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An; Jeong Hoon - Gyeonggi-do KR
An; Jeong Hoon - Icheon-si KR
AN; Jeong Hoon - Icheon-si Gyeonggi-do KR
An; Jeong-hoon - Kyungki-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Composition For Coating Photoresist Pattern And Method For Forming Fine Pattern Using The Same App 20180120707 - LEE; Sung Jae ; et al.	2018-05-03
Semiconductor integrated circuit device with a surface and method of manufacturing the same Grant 9,947,546 - Sim , et al. April 17, 2	2018-04-17
Semiconductor Integrated Circuit Device With A Surface And Method Of Manufacturing The Same App 20170207098 - SIM; Jae Hee ; et al.	2017-07-20
Composition For Coating Photoresist Pattern And Method For Forming Fine Pattern Using The Same App 20170102619 - LEE; Sung Jae ; et al.	2017-04-13
Composition For Coating Photoresist Pattern And Method For Forming Fine Pattern Using The Same App 20170032960 - Lee; Sung Jae ; et al.	2017-02-02
Method and apparatus for supplying fuel of LPG car having LPI system Grant 7,949,460 - Song , et al. May 24, 2	2011-05-24
Wafer processing method for improving gettering capabilities of wafers made therefrom Grant 7,871,904 - An , et al. January 18, 2	2011-01-18
Wafer Processing Method For Improving Gettering Capabilities Of Wafers Made Therefrom App 20100009520 - AN; Jeong Hoon ; et al.	2010-01-14
Method And Apparatus For Supplying Fuel Of Lpg Car Having Lpi System App 20090312935 - Song; Jin-Woo ; et al.	2009-12-17
Methods and systems for measuring microroughness of a substrate combining particle counter and atomic force microscope measurements Grant 6,552,337 - Cho , et al. April 22, 2	2003-04-22
Methods of packaging semiconductor wafers by molding a packing bag about a carrying device that contains the semiconductor wafers App 20020023413 - Shim, Tae-hun ; et al.	2002-02-28

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