Amrine; Craig S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Amrine; Craig S..The latest application filed is for "method for singulating electronic components from a substrate".

Company Profile

0.9.9

Amrine; Craig S. - Tempe AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for singulating electronic components from a substrate Grant 9,142,434 - Gao , et al. September 22, 2	2015-09-22
Packaging an integrated circuit die with backside metallization Grant 8,236,609 - Ramanathan , et al. August 7, 2	2012-08-07
Method For Singulating Electronic Components From A Substrate App 20110217814 - Gao; Wei ; et al.	2011-09-08
Flexible carrier for high volume electronic package fabrication Grant 7,969,026 - Lytle , et al. June 28, 2	2011-06-28
Electronic assembly manufacturing method Grant 7,802,359 - Lytle , et al. September 28, 2	2010-09-28
Integrated circuit package formation Grant 7,741,151 - Amrine , et al. June 22, 2	2010-06-22
Integrated Circuit Package Formation App 20100112756 - Amrine; Craig S. ; et al.	2010-05-06
Packaging An Integrated Circuit Die With Backside Metallization App 20100029045 - Ramanathan; Lakshmi N. ; et al.	2010-02-04
Electronic Assembly Manufacturing Method App 20090165293 - Lytle; William H. ; et al.	2009-07-02
Flexible Carrier For High Volume Electronic Package Fabrication App 20090008802 - Lytle; William H. ; et al.	2009-01-08
Flexible carrier and release method for high volume electronic package fabrication Grant 7,442,581 - Lytle , et al. October 28, 2	2008-10-28
Method For Forming A Microelectronic Assembly Including Encapsulating A Die Using A Sacrificial Layer App 20080182363 - Amrine; Craig S. ; et al.	2008-07-31
Methods and apparatus for thermal management in a multi-layer embedded chip structure Grant 7,405,102 - Lee , et al. July 29, 2	2008-07-29
Methods and apparatus for thermal management in a multi-layer embedded chip structure App 20070284711 - Lee; Tien Yu T. ; et al.	2007-12-13
Flexible carrier and release method for high volume electronic package fabrication App 20060128066 - Lytle; William H. ; et al.	2006-06-15
Die encapsulation using a porous carrier Grant 7,015,075 - Fay , et al. March 21, 2	2006-03-21
Die encapsulation using a porous carrier App 20050176180 - Fay, Owen R. ; et al.	2005-08-11

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