AMOU; Satoru

Patent Applications and Registrations

Patent applications and USPTO patent grants for AMOU; Satoru.The latest application filed is for "resin composition and electrical device".

Company Profile

0.27.38

AMOU; Satoru - Tokyo JP
Amou; Satoru - Hitachi JP
AMOU; Satoru - Hitachi-shi JP
Amou, Satoru - Hirachi JP
Amou, Satoru - Hitachinaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin Composition And Electrical Device App 20170145209 - KAJIHARA; Yuri ; et al.	2017-05-25
Epoxy-vinyl copolymerization type liquid resin composition, cured product of the same, electronic/electric apparatus using the cured product, and method of producing the cured product Grant 9,493,605 - Amou November 15, 2	2016-11-15
Insulated Wire and Dynamo-Electric Machine Using the Same App 20160163420 - ARAYA; Koutarou ; et al.	2016-06-09
Insulated Wire, Rotary Electric Machine, and Method for Manufacturing Insulated Wire App 20160042836 - OKABE; Yoshiaki ; et al.	2016-02-11
Low-Melting-Point Glass Resin Composite Material and Electronic/Electric Apparatus Using Same App 20150337106 - KAJIHARA; Yuri ; et al.	2015-11-26
Organic-inorganic composite materials containing triazine rings and electrical devices using the same Grant 9,090,796 - Tanase , et al. July 28, 2	2015-07-28
Thermosetting Resin Composition And Electrical Device Using Same App 20150152230 - Muraki; Takahito ; et al.	2015-06-04
Thermosetting adhesive composition, and heat resistant adhesive film and wiring film using the same Grant 9,034,475 - Amou , et al. May 19, 2	2015-05-19
Adhesive composition, varnish, adhesive film and wiring film Grant 9,028,970 - Amou , et al. May 12, 2	2015-05-12
Epoxy-Vinyl Copolymerization Type Liquid Resin Composition, Cured Product of the Same, Electronic/Electric Apparatus using the Cured Product, and Method of Producing the Cured Product App 20140378580 - Amou; Satoru	2014-12-25
Organic-inorganic Composite And Method For Manufacturing The Same App 20140211373 - Oyama; Taku ; et al.	2014-07-31
Electric equipment having insulation structure at welding parts Grant 8,735,724 - Muraki , et al. May 27, 2	2014-05-27
Self-repairing Laminated Structure And Self-fusing Insulated Wire App 20140141254 - Araya; Kotaro ; et al.	2014-05-22
Low softening point glass composition, bonding material using same and electronic parts Grant 8,685,872 - Naito , et al. April 1, 2	2014-04-01
Low Softening Point Glass Composition, Bonding Material Using Same Adn Electronic Parts App 20130333748 - NAITO; Takashi ; et al.	2013-12-19
Adhesive Composition, Varnish, Adhesive Film and Wiring Film App 20130220674 - AMOU; Satoru ; et al.	2013-08-29
Thermosetting Adhesive Composition, and Heat Resistant Adhesive Film and Wiring Film Using the Same App 20130220677 - AMOU; Satoru ; et al.	2013-08-29
Thermosetting Resin Composition, Cured Material, Conductive Wire, Coil For Electrical Device, And Electrical Device App 20130209802 - MURAKI; Takahito ; et al.	2013-08-15
Adhesive composition, adhesive film and wiring film using the same Grant 8,507,592 - Amou , et al. August 13, 2	2013-08-13
Low softening point glass composition, bonding material using same and electronic parts Grant 8,470,723 - Naito , et al. June 25, 2	2013-06-25
Organic-inorganic Composite Materials Containing Triazine Rings And Electrical Devices Using The Same App 20130131248 - TANASE; Tomokazu ; et al.	2013-05-23
Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof Grant 8,420,210 - Amou , et al. April 16, 2	2013-04-16
Prepreg and printed wiring board using thin quartz glass cloth Grant 8,227,361 - Amou , et al. July 24, 2	2012-07-24
Adhesive Composition, Adhesive Film And Wiring Film Using The Same App 20120138345 - AMOU; Satoru ; et al.	2012-06-07
Electric Equipment Having Insulation Structure At Welding Parts App 20120097447 - MURAKI; Takahito ; et al.	2012-04-26
Thermoplastic Resin Composition, Adhesive Film And Wiring Film Using The Same App 20120037410 - Amou; Satoru ; et al.	2012-02-16
Prepreg and its application products for low thermal expansion and low dielectric tangent Grant 8,115,105 - Amou , et al. February 14, 2	2012-02-14
Phase-separation-controlled polybutadiene resin composition and printed wiring board using the resin composition Grant 8,097,545 - Amou , et al. January 17, 2	2012-01-17
Unsaturated Polyester Resin Composition For Coil Adhesion App 20110316661 - MURAKI; Takahito ; et al.	2011-12-29
Low Dielectric Loss Wiring Board, Multilayer Wiring Board, Copper Foil And Laminate App 20110088933 - AMOU; Satoru ; et al.	2011-04-21
Low Softening Point Glass Composition, Bonding Material Using Same And Electronic Parts App 20100180934 - Naito; Takashi ; et al.	2010-07-22
Thermosetting Resin Composition And Coil For Electric Machine App 20100156587 - Muraki; Takahito ; et al.	2010-06-24
Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish Grant 7,638,564 - Amou , et al. December 29, 2	2009-12-29
Prepreg and printed wiring board using thin quartz glass cloth App 20090266591 - Amou; Satoru ; et al.	2009-10-29
Prepreg And Its Application Products For Low Thermal Expansion And Low Dielectric Tangent App 20090178832 - Amou; Satoru ; et al.	2009-07-16
Prepreg, Multilayer Printed Wiring Board And Electronic Parts Using The Same App 20080261472 - AMOU; Satoru ; et al.	2008-10-23
Low Dielectric Loss Tangent Resin Composition, Curable Film And Cured Product, Electrical Part Using The Same And Method For Production Thereof App 20080221261 - Amou; Satoru ; et al.	2008-09-11
Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof Grant 7,375,155 - Amou , et al. May 20, 2	2008-05-20
Phase-Separation-Controlled Polybutadiene Resin Composition and Printed Wiring Board Using the Resin Composition App 20080090478 - Amou; Satoru ; et al.	2008-04-17
Resin Composition, Prepreg, Laminate Sheet And Printed Wiring Board Using The Same And Method For Production Thereof App 20070292668 - Amou; Satoru ; et al.	2007-12-20
Thin film capacitor and electronic circuit component Grant 7,294,905 - Ogino , et al. November 13, 2	2007-11-13
Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof Grant 7,273,900 - Amou , et al. September 25, 2	2007-09-25
Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish App 20070077413 - Amou; Satoru ; et al.	2007-04-05
Electronic device using low dielectric loss tangent insulators for high frequency signals Grant 7,193,009 - Amou , et al. March 20, 2	2007-03-20
Low dielectric loss tangent films and wiring films Grant 7,112,627 - Amou , et al. September 26, 2	2006-09-26
Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof App 20050277753 - Amou, Satoru ; et al.	2005-12-15
Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof Grant 6,930,140 - Amou , et al. August 16, 2	2005-08-16
Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof App 20050064159 - Amou, Satoru ; et al.	2005-03-24
Semiconductor device and semiconductor package Grant 6,855,952 - Nagai , et al. February 15, 2	2005-02-15
Resin composition containing rubber component, and film and electronic part using the same App 20050020781 - Sugimasa, Masatoshi ; et al.	2005-01-27
Thin film capacitor and electronic circuit component App 20040195567 - Ogino, Masahiko ; et al.	2004-10-07
Tube laminate and method for producing the same App 20040180157 - Ishikawa, Takao ; et al.	2004-09-16
Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof Grant 6,756,441 - Amou , et al. June 29, 2	2004-06-29
Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof App 20040048965 - Amou, Satoru ; et al.	2004-03-11
Semiconductor device and semiconductor package App 20040038021 - Nagai, Akira ; et al.	2004-02-26
Low dielectric loss tangent films and wiring films App 20040038611 - Amou, Satoru ; et al.	2004-02-26
Electronic device using low dielectric loss tangent insulators for high frequency signals App 20040039127 - Amou, Satoru ; et al.	2004-02-26
Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof App 20020161091 - Amou, Satoru ; et al.	2002-10-31
Photosensitive resin composition, and multilayer printed circuit board using the same Grant 6,190,834 - Narahara , et al. February 20, 2	2001-02-20
Multilayer circuit board and photosensitive resin composition used therefor Grant 5,914,216 - Amou , et al. June 22, 1	1999-06-22

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