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Amoah; Yoba Patent Filings

Amoah; Yoba

Patent Applications and Registrations

Patent applications and USPTO patent grants for Amoah; Yoba.The latest application filed is for "backside binary grated lens coupled to front side waveguide".

Company Profile
2.15.14
  • Amoah; Yoba - Fairfax VT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Backside binary grated lens coupled to front side waveguide
Grant 11,409,046 - Amoah , et al. August 9, 2
2022-08-09
Backside Binary Grated Lens Coupled To Front Side Waveguide
App 20200150348 - AMOAH; Yoba ;   et al.
2020-05-14
Backside binary grated lens coupled to front side waveguide
Grant 10,605,992 - Amoah , et al.
2020-03-31
Backside Binary Grated Lens Coupled To Front Side Waveguide
App 20180067264 - AMOAH; Yoba ;   et al.
2018-03-08
Backside binary grated lens coupled to front side waveguide
Grant 9,910,223 - Amoah , et al. March 6, 2
2018-03-06
Frontside coupled waveguide with backside optical connection using a curved spacer
Grant 9,709,748 - Amoah , et al. July 18, 2
2017-07-18
Backside binary grated lens coupled to front side waveguide
Grant 9,690,051 - Amoah , et al. June 27, 2
2017-06-27
Backside Binary Grated Lens Coupled To Front Side Waveguide
App 20170160483 - AMOAH; Yoba ;   et al.
2017-06-08
Tsv wafer with improved fracture strength
Grant 9,607,929 - Adkisson , et al. March 28, 2
2017-03-28
Frontside Coupled Waveguide With Backside Optical Connection
App 20170068052 - Amoah; Yoba ;   et al.
2017-03-09
Backside Binary Grated Lens Coupled To Front Side Waveguide
App 20170003452 - AMOAH; Yoba ;   et al.
2017-01-05
Methods of forming a TSV wafer with improved fracture strength
Grant 9,312,205 - Adkisson , et al. April 12, 2
2016-04-12
Tsv Wafer With Improved Fracture Strength
App 20150348876 - Adkisson; James W. ;   et al.
2015-12-03
Chip identification pattern and method of forming
Grant 9,136,222 - Amoah , et al. September 15, 2
2015-09-15
Tsv Wafer Fracture Strength
App 20150255404 - Adkisson; James W. ;   et al.
2015-09-10
Built-in self-test method and structure
Grant 8,890,557 - Amoah , et al. November 18, 2
2014-11-18
Contact formation method incorporating preventative etch step reducing interlayer dielectric material flake defects
Grant 8,691,690 - Amoah , et al. April 8, 2
2014-04-08
Locally tailoring chemical mechanical polishing (CMP) polish rate for dielectrics
Grant 8,637,403 - Amoah , et al. January 28, 2
2014-01-28
Chip Identification Pattern And Method Of Forming
App 20130299939 - Amoah; Yoba ;   et al.
2013-11-14
Built-in Self-test Method And Structure
App 20130265068 - Amoah; Yoba ;   et al.
2013-10-10
Locally Tailoring Chemical Mechanical Polishing (cmp) Polish Rate For Dielectrics
App 20130147067 - AMOAH; Yoba ;   et al.
2013-06-13
Contact Formation Method Incorporating A Preventative Etch Step For Reducing Interlayer Dielectric Material Flake Defects
App 20120064714 - Amoah; Yoba ;   et al.
2012-03-15

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