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name:-0.0063009262084961
name:-0.0044019222259521
name:-0.00038790702819824
Amey; Daniel I. Patent Filings

Amey; Daniel I.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Amey; Daniel I..The latest application filed is for "bendable circuit board for led mounting and interconnection".

Company Profile
0.4.6
  • Amey; Daniel I. - Durham NC
  • Amey; Daniel I. - Hockessin DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Bendable Circuit Board For Led Mounting And Interconnection
App 20140226347 - Amey; Daniel I. ;   et al.
2014-08-14
Bendable circuit board for LED mounting and interconnection
Grant 8,707,551 - Amey , et al. April 29, 2
2014-04-29
Bendable Circuit Board For Led Mounting And Interconnection
App 20130330533 - Amey; Daniel I. ;   et al.
2013-12-12
Bendable Circuit Structure For Led Mounting And Interconnection
App 20120024579 - AMEY; DANIEL I. ;   et al.
2012-02-02
Power core devices and methods of making thereof
Grant 7,902,662 - Amey , et al. March 8, 2
2011-03-08
Bendable Circuit Structure For Led Mounting And Interconnection
App 20100304180 - Amey; Daniel I. ;   et al.
2010-12-02
Methods for forming process test capacitors for testing embedded passives during embedment into a printed wiring board
Grant 7,649,361 - Borland , et al. January 19, 2
2010-01-19
Power core devices and methods of making thereof
App 20080236877 - Amey; Daniel I. ;   et al.
2008-10-02
Methods for Forming Process Test Capacitors for Testing Embedded Passives During Embedment into a Printed Wiring Board
App 20080145995 - Borland; William J. ;   et al.
2008-06-19
Substrate and ceramic package
Grant 5,519,176 - Goodman , et al. May 21, 1
1996-05-21

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