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Patent applications and USPTO patent grants for Amasaki; Hiroko.The latest application filed is for "wet etched insulator and electronic circuit component".
Patent | Date |
---|---|
Wet etched insulator and electronic circuit component Grant 8,308,967 - Sakayori , et al. November 13, 2 | 2012-11-13 |
Laminate and use thereof Grant 8,252,423 - Sakayori , et al. August 28, 2 | 2012-08-28 |
Wet Etched Insulator And Electronic Circuit Component App 20110108519 - SAKAYORI; Katsuya ;   et al. | 2011-05-12 |
Laminate And Use Thereof App 20110076855 - SAKAYORI; Katsuya ;   et al. | 2011-03-31 |
Wet etched insulator and electronic circuit component Grant 7,226,806 - Sakayori , et al. June 5, 2 | 2007-06-05 |
Wet etched insulator and electronic circuit component App 20070120229 - Sakayori; Katsuya ;   et al. | 2007-05-31 |
Method of manufacturing wireless suspension blank Grant 6,942,817 - Yagi , et al. September 13, 2 | 2005-09-13 |
Method of manufacturing wireless suspension blank Grant 6,750,148 - Sakayori , et al. June 15, 2 | 2004-06-15 |
Production process of electronic component using wet etching, electronic component, and suspension for hard disk Grant 6,709,988 - Sakayori , et al. March 23, 2 | 2004-03-23 |
Laminate and use thereof App 20040043232 - Sakayori, Katsuya ;   et al. | 2004-03-04 |
Wet etched insulator and electronic circuit component App 20030085451 - Sakayori, Katsuya ;   et al. | 2003-05-08 |
Production process of electronic component using wet etching, electronic component, and suspension for hard disk App 20030052078 - Sakayori, Katsuya ;   et al. | 2003-03-20 |
Method of manufacturing wireless suspension blank App 20020027127 - Yagi, Hiroshi ;   et al. | 2002-03-07 |
Method of manufacturing wireless suspension blank App 20020003127 - Sakayori, Katsuya ;   et al. | 2002-01-10 |
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