Amanapu; Hari P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Amanapu; Hari P..The latest application filed is for "forming dual metallization interconnect structures in single metallization level".

Company Profile

8.6.6

Amanapu; Hari P. - Guilderland NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Forming dual metallization interconnect structures in single metallization level Grant 11,037,875 - Amanapu , et al. June 15, 2	2021-06-15
Forming dual metallization interconnect structures in single metallization level Grant 11,031,337 - Amanapu , et al. June 8, 2	2021-06-08
Forming dual metallization interconnect structures in single metallization level Grant 10,559,530 - Amanapu , et al. Feb	2020-02-11
Forming Dual Metallization Interconnect Structures In Single Metallization Level App 20190311986 - Amanapu; Hari P. ; et al.	2019-10-10
Cobalt contact and interconnect structures Grant 10,373,867 - Amanapu , et al.	2019-08-06
Forming Dual Metallization Interconnect Structures In Single Metallization Level App 20190221519 - Amanapu; Hari P. ; et al.	2019-07-18
Low-resistivity Metallic Interconnect Structures With Self-forming Diffusion Barrier Layers App 20190221477 - Amanapu; Hari P. ; et al.	2019-07-18
Forming Dual Metallization Interconnect Structures In Single Metallization Level App 20190198444 - Amanapu; Hari P. ; et al.	2019-06-27
Low-resistivity metallic interconnect structures with self-forming diffusion barrier layers Grant 10,204,829 - Amanapu , et al. Feb	2019-02-12
Cobalt contact and interconnect structures Grant 10,177,030 - Amanapu , et al. J	2019-01-08
Cobalt Contact And Interconnect Structures App 20180197774 - Amanapu; Hari P. ; et al.	2018-07-12
Cobalt Contact And Interconnect Structures App 20180197773 - Amanapu; Hari P. ; et al.	2018-07-12

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