Alvarez; Sheila Marie L.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Alvarez; Sheila Marie L..The latest application filed is for "semiconductor device and method of forming wire studs as vertical interconnect in fo-wlp".

Company Profile

1.29.23

Alvarez; Sheila Marie L. - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP Grant 10,446,523 - Marimuthu , et al. Oc	2019-10-15
Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof Grant 9,679,769 - Camacho , et al. June 13, 2	2017-06-13
Integrated circuit packaging system with support structure and method of manufacture thereof Grant 9,502,267 - Chi , et al. November 22, 2	2016-11-22
Semiconductor Device and Method of Forming Wire Studs as Vertical Interconnect in FO-WLP App 20160336299 - Marimuthu; Pandi C. ; et al.	2016-11-17
Semiconductor device having wire studs as vertical interconnect in FO-WLP Grant 9,443,797 - Marimuthu , et al. September 13, 2	2016-09-13
Integrated circuit packaging system with insulated trace and method of manufacture thereof Grant 9,406,642 - Chi , et al. August 2, 2	2016-08-02
Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof Grant 9,406,531 - Camacho , et al. August 2, 2	2016-08-02
Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof Grant 9,331,003 - Camacho , et al. May 3, 2	2016-05-03
Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuring Grant 9,330,994 - Camacho , et al. May 3, 2	2016-05-03
Semiconductor Device and Method of Forming RDL and Vertical Interconnect by Laser Direct Structuring App 20150279778 - Camacho; Zigmund R. ; et al.	2015-10-01
Integrated Circuit Packaging System With Conductive Ink And Method Of Manufacture Thereof App 20150179602 - Camacho; Zigmund Ramirez ; et al.	2015-06-25
Semiconductor Device and Method of Forming Wire Studs as Vertical Interconnect in FO-WLP App 20140077364 - Marimuthu; Pandi C. ; et al.	2014-03-20
Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof Grant 8,405,230 - Lee , et al. March 26, 2	2013-03-26
Semiconductor package heat spreader Grant 8,207,598 - Ararao , et al. June 26, 2	2012-06-26
Integrated circuit package system employing device stacking Grant 8,174,127 - Dahilig , et al. May 8, 2	2012-05-08
Integrated circuit package system employing device stacking and method of manufacture thereof Grant 8,120,187 - Dahilig , et al. February 21, 2	2012-02-21
Integrated Circuit Package System Employing Device Stacking App 20110147899 - Dahilig; Frederick Rodriguez ; et al.	2011-06-23
Semiconductor Flip Chip Package Having Substantially Non-collapsible Spacer And Method Of Manufacture Thereof App 20110108970 - Lee; Jae Soo ; et al.	2011-05-12
Integrated Circuit Package System Employing Device Stacking And Method Of Manufacture Thereof App 20110012270 - Dahilig; Frederick Rodriguez ; et al.	2011-01-20
Integrated circuit package system employing device stacking Grant 7,830,020 - Dahilig , et al. November 9, 2	2010-11-09
Semiconductor Package Heat Spreader App 20090273062 - Ararao; Virgil Cotoco ; et al.	2009-11-05
Fabrication method for semiconductor package heat spreaders Grant 7,575,956 - Ararao , et al. August 18, 2	2009-08-18
Integrated circuit encapsulation system with vent Grant 7,482,683 - Dimaano, Jr. , et al. January 27, 2	2009-01-27
Integrated Circuit Package System Employing Device Stacking App 20080315411 - Dahilig; Frederick Rodriguez ; et al.	2008-12-25
Integrated Circuit Package System With Perimeter Paddle App 20080284038 - Dimaano, JR.; Antonio B. ; et al.	2008-11-20
System For Implementing Hard-metal Wire Bonds App 20080272487 - Shim; Il Kwon ; et al.	2008-11-06
Integrated circuit package system with downset lead Grant 7,443,015 - Punzalan , et al. October 28, 2	2008-10-28
Etched leadframe flipchip package system Grant 7,414,318 - Shim , et al. August 19, 2	2008-08-19
Semiconductor package with controlled solder bump wetting Grant 7,352,055 - Shim , et al. April 1, 2	2008-04-01
Heat spreader for thermally enhanced semiconductor package Grant 7,327,025 - Shim , et al. February 5, 2	2008-02-05
Integrated Circuit Encapsulation System With Vent App 20070262423 - Dimaano; Antonio B. JR. ; et al.	2007-11-15
Etched Leadframe Flipchip Package System App 20070241432 - Shim; Il Kwon ; et al.	2007-10-18
Etched leadframe flipchip package system Grant 7,250,685 - Shim , et al. July 31, 2	2007-07-31
Etched Leadframe Flipchip Package System App 20070108565 - Shim; Il Kwon ; et al.	2007-05-17
Integrated Circuit Package System With Downset Lead App 20070108624 - Punzalan; Jeffrey D. ; et al.	2007-05-17
Semiconductor Package With Controlled Solder Bump Wetting App 20070090537 - Shim; Il Kwon ; et al.	2007-04-26
Semiconductor package with selective underfill and fabrication method therfor Grant 7,169,641 - Shim , et al. January 30, 2	2007-01-30
Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor Grant 7,153,725 - Wang , et al. December 26, 2	2006-12-26
Semiconductor package with controlled solder bump wetting and fabrication method therefor Grant 7,148,086 - Shim , et al. December 12, 2	2006-12-12
Semiconductor package with selective underfill and fabrication method therfor App 20060252177 - Shim; Il Kwon ; et al.	2006-11-09
Semiconductor Package With Controlled Solder Bump Wetting And Fabrication Method Therefor App 20060246629 - Shim; IL Kwon ; et al.	2006-11-02
Heat spreader for thermally enhanced semiconductor package App 20050242428 - Shim, Il Kwon ; et al.	2005-11-03
Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor App 20050161780 - Wang, Tie ; et al.	2005-07-28
Semiconductor package heat spreaders and fabrication methods therefor App 20050112796 - Ararao, Virgil Cotoco ; et al.	2005-05-26
Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices Grant 6,775,140 - Shim , et al. August 10, 2	2004-08-10
Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices App 20040075987 - Shim, Il Kwon ; et al.	2004-04-22

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