| Patent | Date |
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Microelectronic device with embedded die substrate on interposer
Grant 11,430,740 - May , et al. August 30, 2 | 2022-08-30 |
Microelectronic Device With Embedded Die Substrate On Interposer
App 20220230965 - MAY; Robert Alan ; et al. | 2022-07-21 |
Stripped Redistrubution-layer Fabrication For Package-top Embedded Multi-die Interconnect Bridge
App 20220230958 - SIR; Jiun Hann ; et al. | 2022-07-21 |
Microelectronic Device With Embedded Die Substrate On Interposer
App 20220108957 - MAY; Robert Alan ; et al. | 2022-04-07 |
Hybrid Microelectronic Substrates
App 20210384094 - Starkston; Robert ; et al. | 2021-12-09 |
Hybrid microelectronic substrates
Grant 11,114,353 - Starkston , et al. September 7, 2 | 2021-09-07 |
Microelectronic Package With Substrate Cavity For Bridge-attach
App 20210272905 - Karhade; Omkar G. ; et al. | 2021-09-02 |
Pseudo-stripline using double solder-resist structure
Grant 11,107,780 - May , et al. August 31, 2 | 2021-08-31 |
Embedded Multi-die Interconnect Bridge Packages With Lithotgraphically Formed Bumps And Methods Of Assembling Same
App 20210257303 - ALUR; Amruthavalli Pallavi ; et al. | 2021-08-19 |
Package substrate having polymer-derived ceramic core
Grant 11,075,130 - Chen , et al. July 27, 2 | 2021-07-27 |
Stripped Redistrubution-layer Fabrication For Package-top Embedded Multi-die Interconnect Bridge
App 20210202380 - SIR; Jiun Hann ; et al. | 2021-07-01 |
Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same
Grant 11,043,457 - Alur , et al. June 22, 2 | 2021-06-22 |
Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge
Grant 10,998,262 - Sir , et al. May 4, 2 | 2021-05-04 |
Asymmetric electronic substrate and method of manufacture
Grant 10,980,129 - Chavali , et al. April 13, 2 | 2021-04-13 |
Substrate For An Electronic Device
App 20200411413 - Alur; Amruthavalli Pallavi ; et al. | 2020-12-31 |
Pseudo-stripline Using Double Solder-resist Structure
App 20200388582 - May; Lilia ; et al. | 2020-12-10 |
Stripped Redistrubution-layer Fabrication For Package-top Embedded Multi-die Interconnect Bridge
App 20200328151 - Sir; Jiun Hann ; et al. | 2020-10-15 |
Embedded Multi-die Interconnect Bridge Packages With Lithotgraphically Formed Bumps And Methods Of Assembling Same
App 20200303310 - ALUR; Amruthavalli Pallavi ; et al. | 2020-09-24 |
Plated through hole socketing coupled to a solder ball to engage with a pin
Grant 10,741,947 - Alur , et al. A | 2020-08-11 |
Multi-packaging for single-socketing
Grant 10,734,358 - Rosch , et al. | 2020-08-04 |
Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same
Grant 10,707,168 - Alur , et al. | 2020-07-07 |
Asymmetric electronic substrate and method of manufacture
Grant 10,624,213 - Chavali , et al. | 2020-04-14 |
Microelectronic Device Interconnect Structure
App 20200006273 - Dubey; Manish ; et al. | 2020-01-02 |
Package Substrate Having Polymer-derived Ceramic Core
App 20190393109 - CHEN; Lisa Ying Ying ; et al. | 2019-12-26 |
Multi-packaging For Single-socketing
App 20190385979 - Rosch; Jonathan L. ; et al. | 2019-12-19 |
Microelectronic Device With Embedded Die Substrate On Interposer
App 20190341351 - May; Robert Alan ; et al. | 2019-11-07 |
Plated Through Hole Socketing
App 20190214751 - Alur; Amruthavalli Pallavi ; et al. | 2019-07-11 |
Embedded Multi-die Interconnect Bridge Packages With Lithotgraphically Formed Bumps And Methods Of Assembling Same
App 20190198445 - Alur; Amruthavalli Pallavi ; et al. | 2019-06-27 |
Hybrid Microelectronic Substrates
App 20190057915 - Starkston; Robert ; et al. | 2019-02-21 |
Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same
Grant 10,163,798 - Alur , et al. Dec | 2018-12-25 |
Metal protected fan-out cavity
Grant 9,953,959 - Darmawikarta , et al. April 24, 2 | 2018-04-24 |
Electronic package with narrow-factor via including finish layer
Grant 9,603,247 - Swaminathan , et al. March 21, 2 | 2017-03-21 |
Electronic Package With Narrow-factor Via Including Finish Layer
App 20160044786 - Swaminathan; Rajasekaran ; et al. | 2016-02-11 |
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