name:-0.090227127075195
name:-0.050632953643799
name:-0.0070979595184326
ALPHA METALS, INC. Patent Filings

ALPHA METALS, INC.

Patent Applications and Registrations

Patent applications and USPTO patent grants for ALPHA METALS, INC..The latest application filed is for "high impact solder toughness alloy".

Company Profile
0.16.46
  • ALPHA METALS, INC. - South Plainfield NJ US
  • ALPHA METALS, INC. - Souht Plainfield NJ US
  • Fry's Metals, Inc. d/b/a Alpha Metals, Inc. -
  • Alpha Metals, Inc. - Jersey City NJ
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks
Patent Activity
PatentDate
High Impact Solder Toughness Alloy
App 20180290244 - Pandher; Ranjit ;   et al.
2018-10-11
Production of Graphene
App 20180072573 - Chaki; Nirmalya Kumar ;   et al.
2018-03-15
Jettable Inks For Solar Cell and Semiconductor Fabrication
App 20170204523 - PROKOPIAK; Steven ;   et al.
2017-07-20
Sintering Materials and Attachment Methods Using Same
App 20170144221 - GHOSHAL; Shamik ;   et al.
2017-05-25
High Impact Solder Toughness Alloy
App 20170136583 - Pandher; Ranjit ;   et al.
2017-05-18
Engineered Residue Solder Paste Technology
App 20170135227 - Ramakrishna; Hosur Venkatagiriyappa ;   et al.
2017-05-11
Multilayered Metal Nano and Micron Particles
App 20170113306 - Ghoshal; Shamik ;   et al.
2017-04-27
Flux formulations
Grant 9,566,668 - Pujari , et al. February 14, 2
2017-02-14
Low Pressure Sintering Powder
App 20170033073 - GHOSHAL; Shamik ;   et al.
2017-02-02
Method for Manufacturing Metal Powder
App 20170028477 - Setna; Rohan P. ;   et al.
2017-02-02
Rosin-Free Thermosetting Flux Formulations
App 20160318134 - Ribas; Morgana de Avila ;   et al.
2016-11-03
Metal Recovery
App 20160304989 - Pujari; Narahari ;   et al.
2016-10-20
Lead-Free, Silver-Free Solder Alloys
App 20160271738 - Murphy; Michael ;   et al.
2016-09-22
Conductive Compositions and Methods of Using Them
App 20160251495 - Hariharan; Rajan ;   et al.
2016-09-01
Sintering Materials And Attachment Methods Using Same
App 20160225737 - Khaselev; Oscar ;   et al.
2016-08-04
High Impact Solder Toughness Alloy
App 20160214213 - Pandher; Ranjit ;   et al.
2016-07-28
Composite And Multilayered Silver Films For Joining Electrical And Mechanical Components
App 20160207286 - Khaselev; Oscar ;   et al.
2016-07-21
Joining To Aluminium
App 20160175994 - Pandher; Ranjit ;   et al.
2016-06-23
Dual-side Reinforcement Flux For Encapsulation
App 20160163672 - Venkatagiriyappa; Ramakrishna Hosur ;   et al.
2016-06-09
Conductive compositions and methods of using them
Grant 9,355,938 - Hariharan , et al. May 31, 2
2016-05-31
High Impact Solder Toughness Alloy
App 20160144462 - Pandher; Ranjit ;   et al.
2016-05-26
Solder Alloy
App 20160107267 - Ingham; Anthony ;   et al.
2016-04-21
Lead-free And Antimony-free Tin Solder Reliable At High Temperatures
App 20160023309 - Choudhury; Pritha ;   et al.
2016-01-28
Solder alloy
Grant 9,221,131 - Ingham , et al. December 29, 2
2015-12-29
Particles and inks and films using them
Grant 9,217,088 - Parashar , et al. December 22, 2
2015-12-22
Sintering Powder
App 20150353804 - Ghosal; Shamik ;   et al.
2015-12-10
Lead-free And Antimony-free Tin Solder Reliable At High Temperatures
App 20150266137 - Choudhury; Pritha ;   et al.
2015-09-24
Lead-free And Antimony-free Tin Solder Reliable At High Temperatures
App 20150224604 - Choudhury; Pritha ;   et al.
2015-08-13
Solder Preforms And Solder Alloy Assembly Methods
App 20150078810 - Koep; Paul Joseph ;   et al.
2015-03-19
Systems And Methods For Void Reduction In A Solder Joint
App 20140328039 - Koep; Paul J. ;   et al.
2014-11-06
High Impact Toughness Solder Alloy
App 20140219711 - Pandher; Ranjit ;   et al.
2014-08-07
Solder Compositions
App 20140199115 - de Avila Ribas; Morgana ;   et al.
2014-07-17
Solvent Systems For Metals And Inks
App 20140186524 - Khaselev; Oscar ;   et al.
2014-07-03
Conductive Compositions And Methods Of Using Them
App 20140153167 - Hariharan; Rajan ;   et al.
2014-06-05
Methods For Attachment And Devices Produced Using The Methods
App 20140153203 - Boureghda; Monnir ;   et al.
2014-06-05
Flux Formulations
App 20140060703 - Pujari; Narahari ;   et al.
2014-03-06
Solvent systems for metals and inks
Grant 8,597,548 - Khaselev , et al. December 3, 2
2013-12-03
Mono-acid hybrid conductive composition and method
Grant 8,564,140 - Hariharan , et al. October 22, 2
2013-10-22
Methods of attaching a die to a substrate
Grant 8,555,491 - Boureghda , et al. October 15, 2
2013-10-15
Coated stencil with reduced surface tension
App 20040261636 - Fleck, Ian McPhee ;   et al.
2004-12-30
Process for silver plating in printed circuit board manufacture
Grant 6,319,543 - Soutar , et al. November 20, 2
2001-11-20
Post-treatment for copper on printed circuit boards
Grant 6,294,220 - McGrath , et al. September 25, 2
2001-09-25
Internally heated pyrolysis zone
Grant 6,051,276 - Wary , et al. April 18, 2
2000-04-18
Process for silver plating in printed circuit board manufacture
Grant 5,955,141 - Soutar , et al. September 21, 1
1999-09-21
Parylene polymer layers
Grant 5,879,808 - Wary , et al. March 9, 1
1999-03-09
Improved cleaning solvent containing non-azeotropic mixtures of 1,1,1-trichloroethane and n-propanol
Grant 4,086,179 - Schneider April 25, 1
1978-04-25
Self-purging apparatus for determining the quantitative presence of derived ions
Grant 3,973,572 - Brous August 10, 1
1976-08-10
Cleansing Agent Composition
Grant 3,637,513 - Schneider January 25, 1
1972-01-25
Cover For Coplanar Walls Of An Open Top Circuit Package
Grant 3,579,817 - Boyle May 25, 1
1971-05-25

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