Patent applications and USPTO patent grants for ALPHA METALS, INC..The latest application filed is for "high impact solder toughness alloy".
Patent | Date |
---|---|
High Impact Solder Toughness Alloy App 20180290244 - Pandher; Ranjit ;   et al. | 2018-10-11 |
Production of Graphene App 20180072573 - Chaki; Nirmalya Kumar ;   et al. | 2018-03-15 |
Jettable Inks For Solar Cell and Semiconductor Fabrication App 20170204523 - PROKOPIAK; Steven ;   et al. | 2017-07-20 |
Sintering Materials and Attachment Methods Using Same App 20170144221 - GHOSHAL; Shamik ;   et al. | 2017-05-25 |
High Impact Solder Toughness Alloy App 20170136583 - Pandher; Ranjit ;   et al. | 2017-05-18 |
Engineered Residue Solder Paste Technology App 20170135227 - Ramakrishna; Hosur Venkatagiriyappa ;   et al. | 2017-05-11 |
Multilayered Metal Nano and Micron Particles App 20170113306 - Ghoshal; Shamik ;   et al. | 2017-04-27 |
Flux formulations Grant 9,566,668 - Pujari , et al. February 14, 2 | 2017-02-14 |
Low Pressure Sintering Powder App 20170033073 - GHOSHAL; Shamik ;   et al. | 2017-02-02 |
Method for Manufacturing Metal Powder App 20170028477 - Setna; Rohan P. ;   et al. | 2017-02-02 |
Rosin-Free Thermosetting Flux Formulations App 20160318134 - Ribas; Morgana de Avila ;   et al. | 2016-11-03 |
Metal Recovery App 20160304989 - Pujari; Narahari ;   et al. | 2016-10-20 |
Lead-Free, Silver-Free Solder Alloys App 20160271738 - Murphy; Michael ;   et al. | 2016-09-22 |
Conductive Compositions and Methods of Using Them App 20160251495 - Hariharan; Rajan ;   et al. | 2016-09-01 |
Sintering Materials And Attachment Methods Using Same App 20160225737 - Khaselev; Oscar ;   et al. | 2016-08-04 |
High Impact Solder Toughness Alloy App 20160214213 - Pandher; Ranjit ;   et al. | 2016-07-28 |
Composite And Multilayered Silver Films For Joining Electrical And Mechanical Components App 20160207286 - Khaselev; Oscar ;   et al. | 2016-07-21 |
Joining To Aluminium App 20160175994 - Pandher; Ranjit ;   et al. | 2016-06-23 |
Dual-side Reinforcement Flux For Encapsulation App 20160163672 - Venkatagiriyappa; Ramakrishna Hosur ;   et al. | 2016-06-09 |
Conductive compositions and methods of using them Grant 9,355,938 - Hariharan , et al. May 31, 2 | 2016-05-31 |
High Impact Solder Toughness Alloy App 20160144462 - Pandher; Ranjit ;   et al. | 2016-05-26 |
Solder Alloy App 20160107267 - Ingham; Anthony ;   et al. | 2016-04-21 |
Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20160023309 - Choudhury; Pritha ;   et al. | 2016-01-28 |
Solder alloy Grant 9,221,131 - Ingham , et al. December 29, 2 | 2015-12-29 |
Particles and inks and films using them Grant 9,217,088 - Parashar , et al. December 22, 2 | 2015-12-22 |
Sintering Powder App 20150353804 - Ghosal; Shamik ;   et al. | 2015-12-10 |
Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20150266137 - Choudhury; Pritha ;   et al. | 2015-09-24 |
Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20150224604 - Choudhury; Pritha ;   et al. | 2015-08-13 |
Solder Preforms And Solder Alloy Assembly Methods App 20150078810 - Koep; Paul Joseph ;   et al. | 2015-03-19 |
Systems And Methods For Void Reduction In A Solder Joint App 20140328039 - Koep; Paul J. ;   et al. | 2014-11-06 |
High Impact Toughness Solder Alloy App 20140219711 - Pandher; Ranjit ;   et al. | 2014-08-07 |
Solder Compositions App 20140199115 - de Avila Ribas; Morgana ;   et al. | 2014-07-17 |
Solvent Systems For Metals And Inks App 20140186524 - Khaselev; Oscar ;   et al. | 2014-07-03 |
Conductive Compositions And Methods Of Using Them App 20140153167 - Hariharan; Rajan ;   et al. | 2014-06-05 |
Methods For Attachment And Devices Produced Using The Methods App 20140153203 - Boureghda; Monnir ;   et al. | 2014-06-05 |
Flux Formulations App 20140060703 - Pujari; Narahari ;   et al. | 2014-03-06 |
Solvent systems for metals and inks Grant 8,597,548 - Khaselev , et al. December 3, 2 | 2013-12-03 |
Mono-acid hybrid conductive composition and method Grant 8,564,140 - Hariharan , et al. October 22, 2 | 2013-10-22 |
Methods of attaching a die to a substrate Grant 8,555,491 - Boureghda , et al. October 15, 2 | 2013-10-15 |
Coated stencil with reduced surface tension App 20040261636 - Fleck, Ian McPhee ;   et al. | 2004-12-30 |
Process for silver plating in printed circuit board manufacture Grant 6,319,543 - Soutar , et al. November 20, 2 | 2001-11-20 |
Post-treatment for copper on printed circuit boards Grant 6,294,220 - McGrath , et al. September 25, 2 | 2001-09-25 |
Internally heated pyrolysis zone Grant 6,051,276 - Wary , et al. April 18, 2 | 2000-04-18 |
Process for silver plating in printed circuit board manufacture Grant 5,955,141 - Soutar , et al. September 21, 1 | 1999-09-21 |
Parylene polymer layers Grant 5,879,808 - Wary , et al. March 9, 1 | 1999-03-09 |
Improved cleaning solvent containing non-azeotropic mixtures of 1,1,1-trichloroethane and n-propanol Grant 4,086,179 - Schneider April 25, 1 | 1978-04-25 |
Self-purging apparatus for determining the quantitative presence of derived ions Grant 3,973,572 - Brous August 10, 1 | 1976-08-10 |
Cleansing Agent Composition Grant 3,637,513 - Schneider January 25, 1 | 1972-01-25 |
Cover For Coplanar Walls Of An Open Top Circuit Package Grant 3,579,817 - Boyle May 25, 1 | 1971-05-25 |
NCAGE Code | 0FV84 | ALPHA METALS INC |
NCAGE Code | 0X471 | ALPHA METALS INC |
NCAGE Code | 11829 | ALPHA METALS INC |
NCAGE Code | 28175 | ALPHA METALS INC |
NCAGE Code | 2S875 | ALPHA METALS INC |
CAGE Code | 0FV84 | ALPHA METALS INC |
CAGE Code | 0X471 | ALPHA METALS INC |
CAGE Code | 11829 | ALPHA METALS INC |
CAGE Code | 28175 | ALPHA METALS INC |
CAGE Code | 65172 | ALPHA METALS, INC. ALPHA ASSEMBLY SOLUTIONS INC |
CAGE Code | 2S875 | ALPHA METALS INC |
S.A.M. Registration | 65172 [89352983] | ALPHA METALS, INC. |
DUNS | 089352983 | Alpha Metals, Inc. |
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