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Patent applications and USPTO patent grants for Alpaugh; Warren A..The latest application filed is for "printed circuit board or card for direct chip attachment and fabrication thereof".
Patent | Date |
---|---|
Printed circuit board or card for direct chip attachment and fabrication thereof Grant 5,418,689 - Alpaugh , et al. May 23, 1 | 1995-05-23 |
Methyl chloroform-free desmear process in additive circuitization Grant 5,311,660 - Alpaugh , et al. May 17, 1 | 1994-05-17 |
Deposition of copper from electroless plating compositions Grant 4,525,390 - Alpaugh , et al. June 25, 1 | 1985-06-25 |
Treatment of waste compositions Grant 4,289,594 - Alpaugh , et al. September 15, 1 | 1981-09-15 |
Cleaning of high aspect ratio through holes in multilayer printed circuit boards Grant 4,155,775 - Alpaugh , et al. May 22, 1 | 1979-05-22 |
Electroless copper plating process with dissolved oxygen maintained in bath Grant 4,152,467 - Alpaugh , et al. May 1, 1 | 1979-05-01 |
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