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Patent applications and USPTO patent grants for Allen; Sean A..The latest application filed is for "process for making interconnect solder pb-free bumps free from organo-tin/tin deposits on the wafer surface".
Patent | Date |
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Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surface Grant 7,833,897 - Knickerbocker , et al. November 16, 2 | 2010-11-16 |
PROCESS FOR MAKING INTERCONNECT SOLDER Pb-FREE BUMPS FREE FROM ORGANO-TIN/TIN DEPOSITS ON THE WAFER SURFACE App 20090020590 - Knickerbocker; Sarah H. ;   et al. | 2009-01-22 |
Self-contained Cassette Material Cutter And Method Of Cutting App 20080210068 - Weiss; Michael J. ;   et al. | 2008-09-04 |
Self-contained Cassette Material Cutter And Method Of Cutting App 20060053989 - Weiss; Michael J. ;   et al. | 2006-03-16 |
Mechanism for cutting an umbilical cord Grant 5,667,516 - Allen September 16, 1 | 1997-09-16 |
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