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Patent applications and USPTO patent grants for Allardyce; George R..The latest application filed is for "texturing of monocrystalline semiconductor substrates to reduce incident light reflectance".
Patent | Date |
---|---|
Low internal stress copper electroplating method Grant 9,493,886 - Allardyce , et al. November 15, 2 | 2016-11-15 |
Electrochemical etching of semiconductors Grant 9,076,657 - Hamm , et al. July 7, 2 | 2015-07-07 |
Texturing Of Monocrystalline Semiconductor Substrates To Reduce Incident Light Reflectance App 20140004701 - Barr; Robert K. ;   et al. | 2014-01-02 |
Electrochemical etching of semiconductors Grant 8,603,314 - Hamm , et al. December 10, 2 | 2013-12-10 |
Electrochemical Etching Of Semiconductors App 20130288476 - HAMM; Gary ;   et al. | 2013-10-31 |
Low Internal Stress Copper Electroplating Method App 20130240368 - Allardyce; George R. ;   et al. | 2013-09-19 |
Electrochemical Etching Of Semiconductors App 20120184098 - Hamm; Gary ;   et al. | 2012-07-19 |
Enhanced method of forming nickel silicides Grant 7,955,978 - Cahalen , et al. June 7, 2 | 2011-06-07 |
Enhanced Method Of Forming Nickel Silicides App 20110065274 - CAHALEN; John P. ;   et al. | 2011-03-17 |
Plating process App 20080035489 - Allardyce; George R. ;   et al. | 2008-02-14 |
Fluid delivery systems for electronic device manufacture Grant 6,265,020 - Allardyce , et al. July 24, 2 | 2001-07-24 |
Electroplating process and composition Grant 5,528,000 - Allardyce , et al. June 18, 1 | 1996-06-18 |
Electroplating process and composition Grant 5,415,762 - Allardyce , et al. May 16, 1 | 1995-05-16 |
Process for multilayer printed circuit board manufacture Grant 5,106,454 - Allardyce , et al. April 21, 1 | 1992-04-21 |
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