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Method of producing a granulated composition
Grant 11,246,833 - Douroumis , et al. February 15, 2 | 2022-02-15 |
Process of preparing active pharmaceutical ingredient salts
Grant 10,881,616 - Maniruzzaman , et al. January 5, 2 | 2021-01-05 |
Process Of Preparing Active Pharmaceutical Ingredient Salts
App 20190022010 - Maniruzzaman; Mohammed ; et al. | 2019-01-24 |
Method Of Producing A Extruded Composition
App 20180021263 - Douroumis; Dennis ; et al. | 2018-01-25 |
Method Of Producing A Granulated Composition
App 20180015040 - Douroumis; Dennis ; et al. | 2018-01-18 |
Die Reuse In Electrical Circuits
App 20140312475 - Ali; Anwar ; et al. | 2014-10-23 |
Method Of Lowering Capacitances Of Conductive Apertures And An Interposer Capable Of Being Reverse Biased To Achieve Reduced Capacitance
App 20130154109 - Venkatraman; Ramnath ; et al. | 2013-06-20 |
Flipchip bump patterns for efficient I-mesh power distribution schemes
Grant 8,350,375 - Ali , et al. January 8, 2 | 2013-01-08 |
Disabling unused IO resources in platform-based integrated circuits
Grant 8,151,237 - Ali , et al. April 3, 2 | 2012-04-03 |
Separate probe and bond regions of an integrated circuit
Grant 8,115,321 - Ali , et al. February 14, 2 | 2012-02-14 |
Method and apparatus of power ring positioning to minimize crosstalk
Grant 7,863,716 - Ali , et al. January 4, 2 | 2011-01-04 |
Separate Probe And Bond Regions Of An Integrated Circuit
App 20100276816 - ALI; ANWAR ; et al. | 2010-11-04 |
Power configuration method for structured ASICs
Grant 7,737,564 - Ali , et al. June 15, 2 | 2010-06-15 |
Method And Apparatus Of Power Ring Positioning To Minimize Crosstalk
App 20090321897 - Ali; Anwar ; et al. | 2009-12-31 |
Flipchip Bump Patterns For Efficient I-mesh Power Distribution Schemes
App 20090283904 - Ali; Anwar ; et al. | 2009-11-19 |
Method and apparatus of power ring positioning to minimize crosstalk
Grant 7,569,472 - Ali , et al. August 4, 2 | 2009-08-04 |
Pad current splitting
Grant 7,554,133 - Ali , et al. June 30, 2 | 2009-06-30 |
Test pin reduction using package center ball grid array
App 20090160475 - Ali; Anwar ; et al. | 2009-06-25 |
Disabling unused IO resources in platform-based integrated circuits
App 20080320432 - Ali; Anwar ; et al. | 2008-12-25 |
Disabling unused IO resources in platform-based integrated circuits
Grant 7,430,730 - Ali , et al. September 30, 2 | 2008-09-30 |
Method and apparatus of power ring positioning to minimize crosstalk
App 20080099905 - Ali; Anwar ; et al. | 2008-05-01 |
Cell-based method for creating slotted metal in semiconductor designs
Grant 7,328,417 - Ali , et al. February 5, 2 | 2008-02-05 |
Power configuration method for structured ASICs
App 20070164451 - Ali; Anwar ; et al. | 2007-07-19 |
Methods for optimizing package and silicon co-design of integrated circuit
Grant 7,117,467 - Ali , et al. October 3, 2 | 2006-10-03 |
Method of sizing via arrays and interconnects to reduce routing congestion in flip chip integrated circuits
Grant 7,107,561 - Ali , et al. September 12, 2 | 2006-09-12 |
System for implementing a configurable integrated circuit
Grant 7,075,179 - Ali , et al. July 11, 2 | 2006-07-11 |
System for implementing a configurable integrated circuit
App 20060131725 - Ali; Anwar ; et al. | 2006-06-22 |
Methods for optimizing package and silicon co-design of integrated circuit
App 20060036987 - Ali; Anwar ; et al. | 2006-02-16 |
Test structure for detecting bonding-induced cracks
Grant 6,998,638 - Low , et al. February 14, 2 | 2006-02-14 |
Method of sizing via arrays and interconnects to reduce routing congestion in flip chip integrated circuits
App 20060027919 - Ali; Anwar ; et al. | 2006-02-09 |
Disabling unused IO resources in platform-based integrated circuits
App 20060022687 - Ali; Anwar ; et al. | 2006-02-02 |
Cell-based method for creating slotted metal in semiconductor designs
App 20050125759 - Ali, Anwar ; et al. | 2005-06-09 |
Integrated circuit design for both input output limited and core limited integrated circuits
Grant 6,836,026 - Ali , et al. December 28, 2 | 2004-12-28 |
Direct alignment of contacts
Grant 6,815,812 - Ali , et al. November 9, 2 | 2004-11-09 |
Test structure for detecting bonding-induced cracks
App 20040217487 - Low, Qwai H. ; et al. | 2004-11-04 |
Integrated circuit having adaptable core and input/output regions with multi-layer pad trace conductors
Grant 6,798,069 - Ali , et al. September 28, 2 | 2004-09-28 |
Laterally interconnecting structures
Grant 6,784,102 - Yeung , et al. August 31, 2 | 2004-08-31 |
Test structure for detecting bonding-induced cracks
Grant 6,781,150 - Low , et al. August 24, 2 | 2004-08-24 |
Donut power mesh scheme for flip chip package
Grant 6,781,228 - Ishikawa , et al. August 24, 2 | 2004-08-24 |
Circuit component placement
Grant 6,768,142 - Ali , et al. July 27, 2 | 2004-07-27 |
Donut power mesh scheme for flip chip package
App 20040135263 - Ishikawa, Hiroshi ; et al. | 2004-07-15 |
Laterally interconnecting structures
App 20040072421 - Yeung, Max M. ; et al. | 2004-04-15 |
Integrated circuit routing
Grant 6,704,918 - Ali , et al. March 9, 2 | 2004-03-09 |
Test structure
App 20040043656 - Low, Qwai H. ; et al. | 2004-03-04 |
Contact ring architecture
Grant 6,683,476 - Ali , et al. January 27, 2 | 2004-01-27 |
High density input output
Grant 6,671,865 - Ali , et al. December 30, 2 | 2003-12-30 |
Die power distribution system
Grant 6,657,870 - Ali , et al. December 2, 2 | 2003-12-02 |
Direct alignment of contacts
App 20030209797 - Ali, Anwar ; et al. | 2003-11-13 |
Contact ring architecture
App 20030210076 - Ali, Anwar ; et al. | 2003-11-13 |
Circuit component placement
App 20030209731 - Ali, Anwar ; et al. | 2003-11-13 |
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