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Patent applications and USPTO patent grants for Alfaro; Rafael C..The latest application filed is for "apparatus for breaking and separating dies from a wafer".
Patent | Date |
---|---|
Apparatus for breaking and separating dies from a wafer Grant 5,979,728 - Alfaro November 9, 1 | 1999-11-09 |
Wafer method for breaking a semiconductor Grant 5,527,744 - Mignardi , et al. June 18, 1 | 1996-06-18 |
Methods for manufacturing a thermally enhanced molded cavity package having a parallel lid Grant 5,458,716 - Alfaro , et al. October 17, 1 | 1995-10-17 |
Method for obtaining metallurgical stability in integrated circuit conductive bonds Grant 5,455,195 - Ramsey , et al. October 3, 1 | 1995-10-03 |
Grid array masking tape process Grant 5,435,876 - Alfaro , et al. July 25, 1 | 1995-07-25 |
Ultrasonic bonding process beyond 125 kHz Grant 5,244,140 - Ramsey , et al. * September 14, 1 | 1993-09-14 |
Double cone wire bonding capillary Grant 4,974,767 - Alfaro , et al. December 4, 1 | 1990-12-04 |
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