Aldeborgh; John Erik
Patent Applications and Registrations
Patent applications and USPTO patent grants for Aldeborgh; John Erik.The latest application filed is for "polishing pad having micro-grooves on the pad surface".
- Aldeborgh; John Erik - Boxford MA
| Patent | Date |
|---|---|
| Multi-layered chemical-mechanical planarization pad Grant 9,796,063 - Lefevre , et al. October 24, 2 | 2017-10-24 |
| Polishing pad having micro-grooves on the pad surface Grant 9,375,822 - Hsu , et al. June 28, 2 | 2016-06-28 |
| Polishing Pad Having Micro-grooves On The Pad Surface App 20150056894 - HSU; Oscar K. ; et al. | 2015-02-26 |
| Polishing pad having micro-grooves on the pad surface Grant 8,900,036 - Hsu , et al. December 2, 2 | 2014-12-02 |
| Multi-layered Chemical-mechanical Planarization Pad App 20140311043 - LEFEVRE; Paul ; et al. | 2014-10-23 |
| Multi-layered chemical-mechanical planarization pad Grant 8,790,165 - Lefevre , et al. July 29, 2 | 2014-07-29 |
| Method of grooving a chemical-mechanical planarization pad Grant 8,758,659 - Lefevre , et al. June 24, 2 | 2014-06-24 |
| Method Of Manufacturing A Chemical Mechanical Planarization Pad App 20130205679 - ALDEBORGH; John Erik ; et al. | 2013-08-15 |
| Three-dimensional network in CMP pad Grant 8,491,360 - Lefevre , et al. July 23, 2 | 2013-07-23 |
| Chemical-mechanical planarization pad Grant 8,430,721 - Hsu , et al. April 30, 2 | 2013-04-30 |
| Polishing pad with controlled void formation Grant 8,377,351 - Lefevre , et al. February 19, 2 | 2013-02-19 |
| Polishing Pad Having Micro-grooves On The Pad Surface App 20120178348 - HSU; Oscar K. ; et al. | 2012-07-12 |
| Chemical-mechanical planarization pad Grant 8,172,648 - Lefevre , et al. May 8, 2 | 2012-05-08 |
| Method Of Grooving A Chemical-mechanical Planarization Pad App 20120073210 - LEFEVRE; Paul ; et al. | 2012-03-29 |
| Polishing pad having micro-grooves on the pad surface Grant 8,137,166 - Hsu , et al. March 20, 2 | 2012-03-20 |
| Chemical-mechanical planarization pad having end point detection window Grant 7,985,121 - Lefevre , et al. July 26, 2 | 2011-07-26 |
| Multi-layered Chemical-mechanical Planarization Pad App 20100221983 - LEFEVRE; Paul ; et al. | 2010-09-02 |
| Polishing Pad With Controlled Void Formation App 20090246504 - LEFEVRE; Paul ; et al. | 2009-10-01 |
| Chemical-mechanical Planarization Pad App 20090170410 - Hsu; Oscar K. ; et al. | 2009-07-02 |
| Chemical-mechanical Planarization Pad App 20090170413 - Hsu; Oscar K. ; et al. | 2009-07-02 |
| Chemical-Mechanical Planarization Pad Having End Point Detection Window App 20090142989 - LEFEVRE; Paul ; et al. | 2009-06-04 |
| Three-Dimensional Network in CMP Pad App 20090137121 - HSU; Oscar K. ; et al. | 2009-05-28 |
| Polishing Pad Having Micro-Grooves On The Pad Surface App 20080085661 - HSU; Oscar K. ; et al. | 2008-04-10 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 