Alcorn; Paul M.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Alcorn; Paul M..The latest application filed is for "ohmic alloy contact region sealing layer".
- Alcorn; Paul M. - Groton MA
| Patent | Date |
|---|---|
| Ohmic alloy contact region sealing layer Grant 11,145,735 - Duval , et al. October 12, 2 | 2021-10-12 |
| Ohmic Alloy Contact Region Sealing Layer App 20210111263 - Duval; Paul J. ; et al. | 2021-04-15 |
| Reduced junction area barrier-based photodetector Grant 10,199,520 - Smith , et al. Fe | 2019-02-05 |
| Reduced Junction Area Barrier-based Photodetector App 20180286996 - Smith; Edward P. ; et al. | 2018-10-04 |
| Reduced junction area barrier-based photodetector Grant 10,014,424 - Smith , et al. July 3, 2 | 2018-07-03 |
| Reduced Junction Area Barrier-based Photodetector App 20150263204 - Smith; Edward P. ; et al. | 2015-09-17 |
| Monolithic integrated circuit (MMIC) structure and method for forming such structure Grant 9,082,722 - Williams , et al. July 14, 2 | 2015-07-14 |
| Monolithic Integrated Circuit (mmic) Structure And Method For Forming Such Structure App 20140284661 - Williams; Adrian D. ; et al. | 2014-09-25 |
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