name:-0.021795988082886
name:-0.023967027664185
name:-0.0036249160766602
ALCHIMER Patent Filings

ALCHIMER

Patent Applications and Registrations

Patent applications and USPTO patent grants for ALCHIMER.The latest application filed is for "method for forming a metal silicide using a solution containing gold ions and fluorine ions".

Company Profile
2.24.23
  • ALCHIMER - Massy N/A FR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks
Patent Activity
PatentDate
Electrolyte and process for electroplating copper onto a barrier layer
Grant 10,472,726 - Mevellec , et al. Nov
2019-11-12
Machine suitable for plating a cavity of a semi-conductive or conductive substrate such as a through via structure
Grant 10,460,945 - Raynal Oc
2019-10-29
Copper electrodeposition bath containing an electrochemically inert cation
Grant 10,011,914 - Religieux , et al. July 3, 2
2018-07-03
Method for forming a metal silicide using a solution containing gold ions and fluorine ions
Grant 9,564,333 - Mevellec , et al. February 7, 2
2017-02-07
Method For Forming A Metal Silicide Using A Solution Containing Gold Ions And Fluorine Ions
App 20150380254 - MEVELLEC; Vincent ;   et al.
2015-12-31
Method of depositing metallic layers based on nickel or cobalt on a semiconducting solid substrate; kit for application of said method
Grant 9,190,283 - Mevellec , et al. November 17, 2
2015-11-17
Solution and process for activating the surface of a semiconductor substrate
Grant 9,181,623 - Mevellec , et al. November 10, 2
2015-11-10
Electroplating composition for coating a substrate surface with a metal
Grant 9,133,560 - Daviot , et al. September 15, 2
2015-09-15
Electrolyte And Process For Electroplating Copper Onto A Barrier Layer
App 20150218724 - Mevellec; Vincent ;   et al.
2015-08-06
Copper Electrodeposition Bath Containing An Electrochemically Inert Cation
App 20150159291 - RELIGIEUX; Laurianne ;   et al.
2015-06-11
Formation Of Organic Electro-grafted Films On The Surface Of Electrically Conductive Or Semi-conductive Surfaces
App 20150112426 - BUREAU; CHRISTOPHE
2015-04-23
Solution and method for activating the oxidized surface of a semiconductor substrate
Grant 8,883,641 - Mevellec , et al. November 11, 2
2014-11-11
Machine Suitable For Plating A Cavity Of A Semi-conductive Or Conductive Substrate Such As A Through Via Structure
App 20140318975 - Raynal; Frederic
2014-10-30
Device and method to conduct an electrochemical reaction on a surface of a semi-conductor substrate
Grant 8,795,503 - Zahraoui , et al. August 5, 2
2014-08-05
Formation of organic electro-grafted films on the surface of electrically conductive or semi-conductive surfaces
Grant 8,784,635 - Bureau July 22, 2
2014-07-22
Method Of Depositing Metallic Layers Based On Nickel Or Cobalt On A Semiconducting Solid Substrate; Kit For Application Of Said Method
App 20140087560 - Mevellec; Vincent ;   et al.
2014-03-27
Electrodeposition composition and method for coating a semiconductor substrate using the said composition
Grant 8,591,715 - Zahraoui , et al. November 26, 2
2013-11-26
Electroplating method for coating a substrate surface with a metal
Grant 8,574,418 - Monchoix , et al. November 5, 2
2013-11-05
Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method
Grant 8,524,512 - Mevellec September 3, 2
2013-09-03
Copper-electroplating Composition And Process For Filling A Cavity In A Semiconductor Substrate Using This Composition
App 20130168255 - Frederich; Nadia ;   et al.
2013-07-04
Coating method and solutions for enhanced electromigration resistance
Grant 8,405,217 - Bispo , et al. March 26, 2
2013-03-26
Method of selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits
Grant 8,298,946 - Bureau , et al. October 30, 2
2012-10-30
Solution And Method For Activating The Oxidized Surface Of A Semiconductor Substrate
App 20120196441 - Mevellec; Vincent ;   et al.
2012-08-02
Solution And Process For Activating The Surface Of A Semiconductor Substrate
App 20120156892 - Mevellec; Vincent ;   et al.
2012-06-21
Method for modifying insulating or semi-conductive surfaces, and resulting products
Grant 8,133,549 - Bureau , et al. March 13, 2
2012-03-13
Method of preparing an electrically insulating film and application for the metallization of vias
Grant 8,119,542 - Mevellec , et al. February 21, 2
2012-02-21
Device And Method To Conduct An Electrochemical Reaction On A Surface Of A Semi-conductor Substrate
App 20120000785 - Zahraoui; Said ;   et al.
2012-01-05
Method For Repairing Copper Diffusion Barrier Layers On A Semiconductor Solid Substrate And Repair Kit For Implementing This Method
App 20110294231 - Mevellec; Vincent
2011-12-01
Modification process for polymer surfaces, notably for hydroxylation of polymer surfaces and products so obtained
Grant 7,968,653 - Bureau , et al. June 28, 2
2011-06-28
Modification process for polymer surfaces, notably for hydroxylation of polymer surfaces and products so obtained
Grant 7,956,099 - Bureau , et al. June 7, 2
2011-06-07
Electroplating Method For Coating A Substrate Surface With A Metal
App 20100038256 - Monchoix; Herve ;   et al.
2010-02-18
Method Of Preparing An Electrically Insulating Film And Application For The Metallization Of Vias
App 20100003808 - MEVELLEC; Vincent ;   et al.
2010-01-07
Electrodeposition Composition And Method For Coating A Semiconductor Substrate Using The Said Composition
App 20090294293 - ZAHRAOUI; Said ;   et al.
2009-12-03
Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devices
Grant 7,579,274 - Gonzalez , et al. August 25, 2
2009-08-25
Electroplating Composition for Coating a Substrate Surface with a Metal
App 20090183993 - Daviot; Jerome ;   et al.
2009-07-23
Modification Process For Polymer Surfaces, Notably For Hydroxylation Of Polymer Surfaces And Products So Obtained
App 20080249272 - Bureau; Christophe ;   et al.
2008-10-09
Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devices
App 20070272560 - Gonzalez; Jose ;   et al.
2007-11-29
Coating method and solutions for enhanced electromigration resistance
App 20070262449 - Bispo; Isabelle ;   et al.
2007-11-15
Electroplating composition intended for coating a surface of a substrate with a metal
App 20070062818 - Daviot; Jerome ;   et al.
2007-03-22
Method of coating a surface of a substrate with a metal by electroplating
App 20070062817 - Monchoix; Herve ;   et al.
2007-03-22
Company Registrations
NCAGE CodeFAZP4ALCHIMER
CAGE CodeFAZP4ALCHIMER

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed