ALBRECHT, Hans-Jurgen
USPTO Trademark & Patent Filings
Trademark applications and grants for Albrecht, Hans-jurgen. Albrecht, Hans-jurgen has 1 trademark applications. The latest application filed is for "HOMOEOLOGY"
- Company Aliases
- ALBRECHT, Hans-Jurgen
- jurgen hans albrecht
- Albrecht; Hans-Jurgen - Berlin DE
| Entity Type | INDIVIDUAL |
| Address | Graubergstrasse 6 b Miltenberg GERMANY 63897 |
Trademarks Patents
| Patent Application | Date |
|---|---|
| SOLDERING MATERIAL BASED ON SN AG AND CU 20220168851 - 17/675103 Albrecht; Hans-Jurgen ; et al. | 2022-06-02 |
| Solder Alloy for Power Devices and Solder Joint Having a High Current Density 20210008670 - 17/010990 Albrecht; Hans-Jurgen ; et al. | 2021-01-14 |
| SOLDERING MATERIAL BASED ON SN AG AND CU 20200023472 - 16/530053 Albrecht; Hans-Jurgen ; et al. | 2020-01-23 |
| Solder Alloy for Power Devices and Solder Joint Having a High Current Density 20140112710 - 14/001561 Albrecht; Hans-Jurgen ; et al. | 2014-04-24 |
| Soldering material based on sn ag and cu 20070036671 - 10/554274 Albrecht; Hans-Jurgen ; et al. | 2007-02-15 |
| Solder alloy for power devices and solder joint having a high current density 11,331,759 - 17/010,990 Albrecht , et al. May 17, 2 | 2022-05-17 |
| Soldering material based on Sn Ag and Cu 11,285,569 - 16/530,053 Albrecht , et al. March 29, 2 | 2022-03-29 |
| Soldering material based on Sn Ag and Cu 10,376,994 - 10/554,274 Albrecht , et al. A | 2019-08-13 |
| Soldering material based on Sn Ag and Cu 10,376,994 - 10/554,274 Albrecht , et al. A | 2019-08-13 |
| Procedure for processing joints to be soldered 5,192,582 - 07/609,400 Liedke , et al. March 9, 1 | 1993-03-09 |
Mark Image Registration | Serial | Trademark Application Date |
|---|---|
"HOMOEOLOGY" 76040115 |
HOMOEOLOGY 2000-05-04 |
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