Alabin; Leocadio Morona
Patent Applications and Registrations
Patent applications and USPTO patent grants for Alabin; Leocadio Morona.The latest application filed is for "isolated stacked die semiconductor packages".
- Alabin; Leocadio Morona - Singapore PH
| Patent | Date |
|---|---|
| Stackable semiconductor package with embedded die in pre-molded carrier frame Grant 8,314,480 - Galera , et al. November 20, 2 | 2012-11-20 |
| Semiconductor system-in-package and methods for making the same Grant 8,268,671 - Galera , et al. September 18, 2 | 2012-09-18 |
| Isolated stacked die semiconductor packages Grant 8,198,132 - Galera , et al. June 12, 2 | 2012-06-12 |
| Isolated Stacked Die Semiconductor Packages App 20120015482 - Galera; Manolito ; et al. | 2012-01-19 |
| Isolated stacked die semiconductor packages Grant 8,053,883 - Galera , et al. November 8, 2 | 2011-11-08 |
| Stackable Semiconductor Package With Embedded Die In Pre-molded Carrier Frame App 20110193206 - Galera; Manolito Fabres ; et al. | 2011-08-11 |
| Multichip discrete package Grant 7,977,776 - Galera , et al. July 12, 2 | 2011-07-12 |
| Semiconductor Packages With Embedded Heat Sink App 20110163428 - Galera; Manolito Fabres ; et al. | 2011-07-07 |
| Semiconductor system-in-package and method for making the same Grant 7,960,211 - Galera , et al. June 14, 2 | 2011-06-14 |
| Semiconductor System-in-package And Method For Making The Same App 20110121453 - Galera; Manolito ; et al. | 2011-05-26 |
| Leadframe-based chip scale semiconductor packages Grant 7,944,031 - Galera , et al. May 17, 2 | 2011-05-17 |
| Semiconductor system-in-a-package containing micro-layered lead frame Grant 7,923,847 - Galera , et al. April 12, 2 | 2011-04-12 |
| Isolated Stacked Die Semiconductor Packages App 20110062570 - Galera; Manolito ; et al. | 2011-03-17 |
| Folded Lands And Vias For Multichip Semiconductor Packages App 20110062568 - Galera; Manolito ; et al. | 2011-03-17 |
| Micro-layered lead frame semiconductor packages Grant 7,888,781 - Galera , et al. February 15, 2 | 2011-02-15 |
| Multi-chip Semiconductor Package App 20100308461 - Galera; Manolito ; et al. | 2010-12-09 |
| Multi-chip semiconductor package Grant 7,846,773 - Galera , et al. December 7, 2 | 2010-12-07 |
| Multi-chip discrete devices in semiconductor packages Grant 7,843,048 - Galera , et al. November 30, 2 | 2010-11-30 |
| Multichip Discrete Package App 20100244211 - Galera; Manolito Fabres ; et al. | 2010-09-30 |
| Multi-Chip Semiconductor Package App 20100181660 - Galera; Monolito ; et al. | 2010-07-22 |
| Stacked Chip, Micro-layered Lead Frame Semiconductor Package App 20100140773 - Galera; Manolito Fabres ; et al. | 2010-06-10 |
| Leadframe Free Leadless Array Semiconductor Packages App 20100127380 - Galera; Manolito ; et al. | 2010-05-27 |
| Leadframe-based Chip Scale Semiconductor Packages App 20100127365 - Galera; Manolito ; et al. | 2010-05-27 |
| Wafer Level Chip Scale Semiconductor Packages App 20100127375 - Galera; Manolito ; et al. | 2010-05-27 |
| Micro-layered Lead Frame Semiconductor Packages App 20100052118 - Galera; Manolito ; et al. | 2010-03-04 |
| Semiconductor System-in-a-package Containing Micro-layered Lead Frame App 20100052121 - Galera; Manolito ; et al. | 2010-03-04 |
| Isolated Stacked Die Semiconductor Packages App 20100019362 - Galera; Manolito ; et al. | 2010-01-28 |
| Semiconductor System-in-package And Method For Making The Same App 20100019363 - Galera; Manolito ; et al. | 2010-01-28 |
| Multi-chip Discrete Devices In Semiconductor Packages App 20090273067 - Galera; Manolito ; et al. | 2009-11-05 |
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