Akutsu; Toshiaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Akutsu; Toshiaki.The latest application filed is for "abrasive, abrasive set, and method for polishing substrate".

Company Profile

4.14.21

Akutsu; Toshiaki - Tokyo JP
Akutsu; Toshiaki - Hitachi JP
AKUTSU; Toshiaki - Chiyoda-ku Tokyo
AKUTSU; Toshiaki - Hitachi-shi JP
Akutsu; Toshiaki - Ibaraki JP
Akutsu; Toshiaki - Tokai-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polishing liquid, polishing liquid set, and substrate polishing method Grant 11,046,869 - Akutsu , et al. June 29, 2	2021-06-29
Abrasive, abrasive set, and method for polishing substrate Grant 10,759,968 - Minami , et al. Sep	2020-09-01
Polishing agent, polishing agent set, and substrate polishing method Grant 10,557,058 - Akutsu , et al. Feb	2020-02-11
Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate Grant 10,557,059 - Iwano , et al. Feb	2020-02-11
Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate Grant 10,549,399 - Iwano , et al. Fe	2020-02-04
Abrasive, abrasive set, and method for abrading substrate Grant 10,196,542 - Minami , et al. Fe	2019-02-05
Polishing liquid for CMP, and polishing method Grant 10,155,886 - Oota , et al. Dec	2018-12-18
Abrasive, Abrasive Set, And Method For Polishing Substrate App 20180320024 - MINAMI; Hisataka ; et al.	2018-11-08
Polishing Liquid, Polishing Liquid Set, And Substrate Polishing Method App 20180258319 - AKUTSU; Toshiaki ; et al.	2018-09-13
Abrasive, abrasive set, and method for polishing substrate Grant 10,030,172 - Minami , et al. July 24, 2	2018-07-24
Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate Grant 9,932,497 - Iwano , et al. April 3, 2	2018-04-03
Abrasive, Abrasive Set, And Method For Polishing Substrate App 20160319159 - MINAMI; Hisataka ; et al.	2016-11-03
Abrasive, abrasive set, and method for abrading substrate Grant 9,346,977 - Minami , et al. May 24, 2	2016-05-24
Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate Grant 9,346,978 - Iwano , et al. May 24, 2	2016-05-24
Polishing Liquid For Cmp, And Polishing Method App 20160137881 - OOTA; Munehiro ; et al.	2016-05-19
Abrasive, Abrasive Set, And Method For Abrading Substrate App 20160040041 - MINAMI; Hisataka ; et al.	2016-02-11
Polishing agent, polishing agent set and method for polishing base Grant 9,163,162 - Akutsu , et al. October 20, 2	2015-10-20
Polishing Agent, Polishing Agent Set And Method For Polishing Base App 20150232704 - Akutsu; Toshiaki ; et al.	2015-08-20
Slurry, Polishing-solution Set, Polishing Solution, Substrate Polishing Method, And Substrate App 20150140904 - Iwano; Tomohiro ; et al.	2015-05-21
Slurry, Polishing-solution Set, Polishing Solution, Substrate Polishing Method, And Substrate App 20150139885 - Iwano; Tomohiro ; et al.	2015-05-21
Abrasive Grains, Slurry, Polishing Solution, And Manufacturing Methods Therefor App 20150129796 - Iwano; Tomohiro ; et al.	2015-05-14
Slurry, Polishing-solution Set, Polishing Solution, Substrate Polishing Method, And Substrate App 20150132208 - Iwano; Tomohiro ; et al.	2015-05-14
Slurry, Polishing-solution Set, Polishing Solution, Substrate Polishing Method, And Substrate App 20150098887 - Iwano; Tomohiro ; et al.	2015-04-09
Abrasive, Abrasive Set, And Method For Abrading Substrate App 20150024596 - Minami; Hisataka ; et al.	2015-01-22
Polishing Agent, Polishing Agent Set, And Substrate Polishing Method App 20150017806 - Akutsu; Toshiaki ; et al.	2015-01-15
CMP polishing slurry and method of polishing substrate Grant 8,900,335 - Fukasawa , et al. December 2, 2	2014-12-02
Cmp Polishing Liquid, Method For Polishing Substrate, And Electronic Component App 20130059439 - Shinoda; Takashi ; et al.	2013-03-07
Cmp Polishing Liquid, Method For Polishing Substrate, And Electronic Component App 20120299158 - Shinoda; Takashi ; et al.	2012-11-29
Chemical-mechanical Polishing Liquid, And Semiconductor Substrate Manufacturing Method And Polishing Method Using Said Polishing Liquid App 20120214307 - Yoshikawa; Shigeru ; et al.	2012-08-23
Cmp Polishing Slurry And Method Of Polishing Substrate App 20100210109 - Fukasawa; Masato ; et al.	2010-08-19
Cmp Polishing Slurry, Additive Liquid For Cmp Polishing Slurry, And Substrate-polishing Processes Using The Same App 20100015806 - Fukasawa; Masato ; et al.	2010-01-21
Cmp Polishing Slurry and Method of Polishing Substrate App 20080254717 - Fukasawa; Masato ; et al.	2008-10-16
Cmp Polishing Slurry and Method of Polishing Substrate App 20080003925 - Fukasawa; Masato ; et al.	2008-01-03
Polishing slurry for silicon oxide, additive liquid and polishing method App 20070175104 - Nishiyama; Masaya ; et al.	2007-08-02

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