loadpatents
Patent applications and USPTO patent grants for Akutsu; Akira.The latest application filed is for "semiconductor chip production method and surface protection tape".
Patent | Date |
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Mask material for plasma dicing, mask-integrated surface protective tape and method of producing semiconductor chip Grant 11,437,243 - Nishikawa , et al. September 6, 2 | 2022-09-06 |
Semiconductor chip production method and surface protection tape Grant 11,171,032 - Mikami , et al. November 9, 2 | 2021-11-09 |
Method for producing semiconductor chips Grant 10,916,441 - Uchiyama , et al. February 9, 2 | 2021-02-09 |
Semiconductor Chip Production Method And Surface Protection Tape App 20200144095 - Mikami; Kazuki ;   et al. | 2020-05-07 |
Mask-integrated Surface Protective Tape, And Method Of Producing A Semiconductor Chip Using The Same App 20190378747 - AKUTSU; Akira ;   et al. | 2019-12-12 |
Method For Producing Semiconductor Chips App 20190371618 - Uchiyama; Tomoaki ;   et al. | 2019-12-05 |
Mask Material For Plasma Dicing, Mask-integrated Surface Protective Tape And Method Of Producing Semiconductor Chip App 20190295851 - Nishikawa; Takuya ;   et al. | 2019-09-26 |
Portable case Grant 5,857,600 - Akutsu January 12, 1 | 1999-01-12 |
Panniers Grant D401,056 - Akutsu November 17, 1 | 1998-11-17 |
Portable case Grant D399,057 - Akutsu October 6, 1 | 1998-10-06 |
Portable case Grant D397,249 - Akutsu August 25, 1 | 1998-08-25 |
Portable case Grant D395,748 - Akutsu July 7, 1 | 1998-07-07 |
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