Akolkar; Rohan N.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Akolkar; Rohan N..The latest application filed is for "nanopore sequencers".
- Akolkar; Rohan N. - Beachwood OH
- Akolkar; Rohan N. - Hillsboro OR US
| Patent | Date |
|---|---|
| Nanopore Sequencers App 20200132664 - Boyanov; Boyan ; et al. | 2020-04-30 |
| Electroless Cu plating for enhanced self-forming barrier layers Grant 8,766,342 - Akolkar July 1, 2 | 2014-07-01 |
| Barrier layers Grant 8,508,018 - Akolkar , et al. August 13, 2 | 2013-08-13 |
| Electroless Cu Plating For Enhanced Self-forming Barrier Layers App 20120175776 - Akolkar; Rohan N. | 2012-07-12 |
| Cobalt Metal Barrier Layers App 20120161320 - Akolkar; Rohan N. ; et al. | 2012-06-28 |
| Barrierless Single-phase Interconnect App 20120153483 - Akolkar; Rohan N. ; et al. | 2012-06-21 |
| Barrier Layers App 20120077053 - Akolkar; Rohan N. ; et al. | 2012-03-29 |
| Electroless Cu plating for enhanced self-forming barrier layers Grant 8,138,084 - Akolkar March 20, 2 | 2012-03-20 |
| Electroless Cu Plating For Enhanced Self-forming Barrier Layers App 20110147940 - Akolkar; Rohan N. | 2011-06-23 |
| Method of fabricating metal interconnects using a sacrificial layer to protect seed layer prior to gap fill App 20080113508 - Akolkar; Rohan N. ; et al. | 2008-05-15 |
| Electroplating chemistries and methods of forming interconnections Grant 7,338,585 - Akolkar , et al. March 4, 2 | 2008-03-04 |
| Sacrificial tapered trench opening for damascene interconnects App 20080026555 - Dubin; Valery M. ; et al. | 2008-01-31 |
| Electroplating Chemistries and Methods of Forming Interconnections App 20070267297 - Akolkar; Rohan N. ; et al. | 2007-11-22 |
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