Akkinepally; Praneeth Kumar
Patent Applications and Registrations
Patent applications and USPTO patent grants for Akkinepally; Praneeth Kumar.The latest application filed is for "embedded multi-die interconnect bridge having a molded region with through-mold vias".
- Akkinepally; Praneeth Kumar - Tempe AZ
| Patent | Date |
|---|---|
| Embedded Multi-die Interconnect Bridge Having A Molded Region With Through-mold Vias App 20220093515 - Akkinepally; Praneeth Kumar ; et al. | 2022-03-24 |
| Embedded multi-die interconnect bridge having a molded region with through-mold vias Grant 11,233,009 - Akkinepally , et al. January 25, 2 | 2022-01-25 |
| Embedded Multi-die Interconnect Bridge Having A Molded Region With Through-mold Vias App 20210305163 - Akkinepally; Praneeth Kumar ; et al. | 2021-09-30 |
| Microelectronic Assemblies Having Conductive Structures With Different Thicknesses App 20200253037 - Kind Code | 2020-08-06 |
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