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name:-0.012202978134155
name:-0.011763095855713
name:-0.0024950504302979
Akiyama; Tatsuhiko Patent Filings

Akiyama; Tatsuhiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Akiyama; Tatsuhiko.The latest application filed is for "hydrogenated silane composition".

Company Profile
2.13.9
  • Akiyama; Tatsuhiko - Osaka JP
  • Akiyama; Tatsuhiko - Tokyo JP
  • Akiyama; Tatsuhiko - Itami JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Hydrogenated silane composition
Grant 10,676,366 - Abe , et al.
2020-06-09
Hydrogenated silane composition
Grant 10,676,365 - Abe , et al.
2020-06-09
Hydrogenated Silane Composition
App 20190135642 - ABE; Takashi ;   et al.
2019-05-09
Hydrogenated Silane Composition
App 20190135641 - ABE; Takashi ;   et al.
2019-05-09
Cyclohexasilane
Grant 9,764,961 - Imoto , et al. September 19, 2
2017-09-19
Cyclohexasilane And Method For Producing The Same
App 20170158518 - IMOTO; Shin-ya ;   et al.
2017-06-08
Method for producing cyclohexasilane
Grant 9,617,161 - Imoto , et al. April 11, 2
2017-04-11
Cyclohexasilane And Method For Producing The Same
App 20140219893 - IMOTO; Shin-ya ;   et al.
2014-08-07
Semiconductor device and method of manufacturing same
Grant 8,652,880 - Bando , et al. February 18, 2
2014-02-18
Method for manufacturing magnetic memory chip device
Grant 8,524,510 - Misumi , et al. September 3, 2
2013-09-03
Semiconductor Device And Method Of Manufacturing Same
App 20120309131 - BANDO; KOJI ;   et al.
2012-12-06
Semiconductor device and method of manufacturing same
Grant 8,258,604 - Bando , et al. September 4, 2
2012-09-04
Method For Manufacturing Magnetic Memory Chip Device
App 20120122246 - MISUMI; Kazuyuki ;   et al.
2012-05-17
Method for manufacturing magnetic memory chip device
Grant 8,124,425 - Misumi , et al. February 28, 2
2012-02-28
Semiconductor Device And Method Of Manufacturing Same
App 20100164077 - Bando; Koji ;   et al.
2010-07-01
Multiple chip package semiconductor device
Grant 6,545,366 - Michii , et al. April 8, 2
2003-04-08
A Semiconductor Device
App 20020173076 - Michii, Kazunari ;   et al.
2002-11-21
Semiconductor device
App 20020089050 - Michii, Kazunari ;   et al.
2002-07-11
Resin sealed semiconductor device
Grant 4,942,454 - Mori , et al. July 17, 1
1990-07-17
Resin-encapsulated semiconductor device
Grant 4,884,124 - Mori , et al. November 28, 1
1989-11-28

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