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Patent applications and USPTO patent grants for Akiyama; Tatsuhiko.The latest application filed is for "hydrogenated silane composition".
Patent | Date |
---|---|
Hydrogenated silane composition Grant 10,676,366 - Abe , et al. | 2020-06-09 |
Hydrogenated silane composition Grant 10,676,365 - Abe , et al. | 2020-06-09 |
Hydrogenated Silane Composition App 20190135642 - ABE; Takashi ;   et al. | 2019-05-09 |
Hydrogenated Silane Composition App 20190135641 - ABE; Takashi ;   et al. | 2019-05-09 |
Cyclohexasilane Grant 9,764,961 - Imoto , et al. September 19, 2 | 2017-09-19 |
Cyclohexasilane And Method For Producing The Same App 20170158518 - IMOTO; Shin-ya ;   et al. | 2017-06-08 |
Method for producing cyclohexasilane Grant 9,617,161 - Imoto , et al. April 11, 2 | 2017-04-11 |
Cyclohexasilane And Method For Producing The Same App 20140219893 - IMOTO; Shin-ya ;   et al. | 2014-08-07 |
Semiconductor device and method of manufacturing same Grant 8,652,880 - Bando , et al. February 18, 2 | 2014-02-18 |
Method for manufacturing magnetic memory chip device Grant 8,524,510 - Misumi , et al. September 3, 2 | 2013-09-03 |
Semiconductor Device And Method Of Manufacturing Same App 20120309131 - BANDO; KOJI ;   et al. | 2012-12-06 |
Semiconductor device and method of manufacturing same Grant 8,258,604 - Bando , et al. September 4, 2 | 2012-09-04 |
Method For Manufacturing Magnetic Memory Chip Device App 20120122246 - MISUMI; Kazuyuki ;   et al. | 2012-05-17 |
Method for manufacturing magnetic memory chip device Grant 8,124,425 - Misumi , et al. February 28, 2 | 2012-02-28 |
Semiconductor Device And Method Of Manufacturing Same App 20100164077 - Bando; Koji ;   et al. | 2010-07-01 |
Multiple chip package semiconductor device Grant 6,545,366 - Michii , et al. April 8, 2 | 2003-04-08 |
A Semiconductor Device App 20020173076 - Michii, Kazunari ;   et al. | 2002-11-21 |
Semiconductor device App 20020089050 - Michii, Kazunari ;   et al. | 2002-07-11 |
Resin sealed semiconductor device Grant 4,942,454 - Mori , et al. July 17, 1 | 1990-07-17 |
Resin-encapsulated semiconductor device Grant 4,884,124 - Mori , et al. November 28, 1 | 1989-11-28 |
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