Akiyama; Masatsugu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Akiyama; Masatsugu.The latest application filed is for "electronic circuit package".
- Akiyama; Masatsugu - Yokohama JP
- Akiyama; Masatsugu - Yokohama-shi JP
| Patent | Date |
|---|---|
| Electronic circuit package Grant 7,701,743 - Kanekawa , et al. April 20, 2 | 2010-04-20 |
| Electronic circuit package App 20080303175 - Kanekawa; Nobuyasu ; et al. | 2008-12-11 |
| Electronic circuit package Grant 7,425,763 - Kanekawa , et al. September 16, 2 | 2008-09-16 |
| Electronic circuit package App 20070158814 - Kanekawa; Nobuyasu ; et al. | 2007-07-12 |
| Electronic circuit package Grant 7,233,534 - Kanekawa , et al. June 19, 2 | 2007-06-19 |
| Electronic circuit package Grant 7,120,069 - Kanekawa , et al. October 10, 2 | 2006-10-10 |
| Electronic circuit package App 20050248017 - Kanekawa, Nobuyasu ; et al. | 2005-11-10 |
| Electronic circuit package App 20040164324 - Kanekawa, Nobuyasu ; et al. | 2004-08-26 |
| Electronic circuit package Grant 6,728,904 - Kanekawa , et al. April 27, 2 | 2004-04-27 |
| Electronic circuit package App 20030156441 - Kanekawa, Nobuyasu ; et al. | 2003-08-21 |
| Electronic circuit package Grant 6,584,004 - Kanekawa , et al. June 24, 2 | 2003-06-24 |
| Semiconductor multi-chip module App 20010010064 - Kanekawa, Nobuyasu ; et al. | 2001-07-26 |
| Electronic circuit package Grant 6,223,273 - Kanekawa , et al. April 24, 2 | 2001-04-24 |
| Semiconductor multi-chip module Grant 5,789,805 - Kanekawa , et al. August 4, 1 | 1998-08-04 |
| Electronic circuit package including plural bare chips mounted on a single wiring substrate Grant 5,468,992 - Kanekawa , et al. November 21, 1 | 1995-11-21 |
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