Akiyama; Hiroko
Patent Applications and Registrations
Patent applications and USPTO patent grants for Akiyama; Hiroko.The latest application filed is for "semiconductor package resin composition and usage method thereof".
- Akiyama; Hiroko - Sagamihara JP
- Akiyama; Hiroko - Kanagawa-pref. N/A JP
- Akiyama; Hiroko - Kanagawa JP
| Patent | Date |
|---|---|
| Semiconductor package resin composition and usage method thereof Grant 9,773,714 - Kawate , et al. September 26, 2 | 2017-09-26 |
| Adhesive composition Grant 9,333,723 - Akiyama , et al. May 10, 2 | 2016-05-10 |
| Semiconductor package resin composition and usage method thereof Grant 9,230,873 - Kawate , et al. January 5, 2 | 2016-01-05 |
| Semiconductor Package Resin Composition and Usage Method Thereof App 20150329740 - Kawate; Kohichiro ; et al. | 2015-11-19 |
| Semiconductor Package Resin Composition and Usage Method Thereof App 20140217622 - Kawate; Kohichiro ; et al. | 2014-08-07 |
| Adhesive Composition App 20130260137 - Akiyama; Hiroko ; et al. | 2013-10-03 |
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