Akiyama; Hajime

Patent Applications and Registrations

Patent applications and USPTO patent grants for Akiyama; Hajime.The latest application filed is for "sic-soi device and manufacturing method thereof".

Company Profile

6.59.56

Akiyama; Hajime - Tokyo JP
Akiyama; Hajime - Chiyoda-ku N/A JP
Akiyama; Hajime - Kyoto JP
Akiyama; Hajime - Hyogo JP
Akiyama; Hajime - Itami JP
Akiyama; Hajime - Otsu JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
SiC-SOI device and manufacturing method thereof Grant 10,868,123 - Akiyama , et al. December 15, 2	2020-12-15
SiC-SOI DEVICE AND MANUFACTURING METHOD THEREOF App 20200027954 - AKIYAMA; Hajime ; et al.	2020-01-23
Waste gasification melting apparatus and waste gasification melting method using the same Grant 10,228,129 - Horiuchi , et al.	2019-03-12
Semiconductor device and method for testing same Grant 10,228,412 - Akiyama , et al.	2019-03-12
Semiconductor device and electrical contact structure thereof Grant 10,192,797 - Akiyama , et al. Ja	2019-01-29
Apparatus and method for evaluating semiconductor device comprising thermal image processing Grant 10,068,814 - Okada , et al. September 4, 2	2018-09-04
Apparatus and method for evaluating semiconductor device Grant 9,995,786 - Okada , et al. June 12, 2	2018-06-12
Semiconductor device inspection apparatus and semiconductor device inspection method Grant 9,880,196 - Akiyama , et al. January 30, 2	2018-01-30
Semiconductor Device Inspection Apparatus And Semiconductor Device Inspection Method App 20170205442 - AKIYAMA; Hajime ; et al.	2017-07-20
Semiconductor evaluation apparatus Grant 9,678,143 - Okada , et al. June 13, 2	2017-06-13
Foreign matter removal device and foreign matter removal method Grant 9,659,795 - Okada , et al. May 23, 2	2017-05-23
Apparatus And Method For Evaluating Semiconductor Device App 20170139002 - OKADA; Akira ; et al.	2017-05-18
Apparatus And Method For Evaluating Semiconductor Device App 20170092553 - OKADA; Akira ; et al.	2017-03-30
Semiconductor device assessment apparatus Grant 9,551,745 - Akiyama , et al. January 24, 2	2017-01-24
Contact-probe Type Temperature Detector, Semiconductor Device Evaluation Apparatus And Semiconductor Device Evaluating Method App 20160377486 - YAMASHITA; Kinya ; et al.	2016-12-29
Semiconductor Device App 20160343627 - AKIYAMA; Hajime ; et al.	2016-11-24
Semiconductor Device And Method For Testing Same App 20160334458 - AKIYAMA; Hajime ; et al.	2016-11-17
Semiconductor testing jig and semiconductor testing method performed by using the same Grant 9,347,988 - Akiyama , et al. May 24, 2	2016-05-24
Semiconductor evaluating device and semiconductor evaluating method Grant 9,335,371 - Akiyama , et al. May 10, 2	2016-05-10
Wafer suction method, wafer suction stage, and wafer suction system Grant 9,312,160 - Akiyama , et al. April 12, 2	2016-04-12
Waste Gasification Melting Apparatus And Waste Gasification Melting Method Using The Same App 20160053992 - Horiuchi; Satoshi ; et al.	2016-02-25
Semiconductor testing jig and transfer jig for the same Grant 9,257,316 - Okada , et al. February 9, 2	2016-02-09
Inspection apparatus Grant 9,207,257 - Okada , et al. December 8, 2	2015-12-08
Inspection apparatus Grant 9,188,624 - Okada , et al. November 17, 2	2015-11-17
Semiconductor device Grant 9,121,899 - Akiyama , et al. September 1, 2	2015-09-01
Semiconductor cleaning device and semiconductor cleaning method Grant 9,117,656 - Okada , et al. August 25, 2	2015-08-25
Method for manufacturing semiconductor device Grant 9,117,880 - Akiyama , et al. August 25, 2	2015-08-25
Semiconductor Evaluation Apparatus App 20150115989 - OKADA; Akira ; et al.	2015-04-30
Semiconductor Testing Jig And Transfer Jig For The Same App 20150091599 - OKADA; Akira ; et al.	2015-04-02
Test apparatus and test method Grant 8,980,655 - Okada , et al. March 17, 2	2015-03-17
Inspection apparatus and inspection method Grant 8,981,805 - Okada , et al. March 17, 2	2015-03-17
Semiconductor device Grant 8,975,681 - Akiyama , et al. March 10, 2	2015-03-10
Test Apparatus And Test Method App 20150044788 - OKADA; Akira ; et al.	2015-02-12
Semiconductor Device Assessment Apparatus App 20140347081 - AKIYAMA; Hajime ; et al.	2014-11-27
Semiconductor Device App 20140346514 - Akiyama; Hajime ; et al.	2014-11-27
Method For Manufacturing Semiconductor Device App 20140342544 - AKIYAMA; Hajime ; et al.	2014-11-20
Semiconductor device Grant 8,823,360 - Akiyama , et al. September 2, 2	2014-09-02
Semiconductor Evaluating Device And Semiconductor Evaluating Method App 20140210500 - AKIYAMA; Hajime ; et al.	2014-07-31
Method Of Waste Melting Treatment App 20140202364 - Nakayama; Takashi ; et al.	2014-07-24
Semiconductor Device App 20140077284 - AKIYAMA; Hajime ; et al.	2014-03-20
Inspection Apparatus App 20140015554 - OKADA; Akira ; et al.	2014-01-16
Semiconductor Testing Jig And Semiconductor Testing Method Performed By Using The Same App 20140009183 - AKIYAMA; Hajime ; et al.	2014-01-09
Semiconductor device manufacturing method Grant 8,609,443 - Shimizu , et al. December 17, 2	2013-12-17
Inspection Apparatus And Inspection Method App 20130321015 - OKADA; Akira ; et al.	2013-12-05
Probe Card App 20130321019 - OKADA; Akira ; et al.	2013-12-05
Inspection Apparatus App 20130285684 - OKADA; Akira ; et al.	2013-10-31
Wafer Suction Method, Wafer Suction Stage, And Wafer Suction System App 20130256964 - AKIYAMA; Hajime ; et al.	2013-10-03
Foreign Matter Removal Device And Foreign Matter Removal Method App 20130192630 - OKADA; Akira ; et al.	2013-08-01
Semiconductor Cleaning Device And Semiconductor Cleaning Method App 20130152965 - OKADA; Akira ; et al.	2013-06-20
Semiconductor Device App 20130056791 - SHIMIZU; Kazuhiro ; et al.	2013-03-07
Semiconductor device Grant 8,324,657 - Shimizu , et al. December 4, 2	2012-12-04
Semiconductor Device App 20120161751 - Akiyama; Hajime ; et al.	2012-06-28
Dielectric isolation type semiconductor device and manufacturing method therefor Grant 8,125,045 - Akiyama February 28, 2	2012-02-28
Semiconductor device and method of manufacturing the same Grant 8,110,449 - Akiyama February 7, 2	2012-02-07
Method for manufacturing dielectric isolation type semiconductor device Grant 8,071,454 - Akiyama December 6, 2	2011-12-06
Method For Manufacturing Dielectric Isolation Type Semiconductor Device App 20110281419 - AKIYAMA; Hajime	2011-11-17
Semiconductor Device App 20110254049 - SHIMIZU; Kazuhiro ; et al.	2011-10-20
Semiconductor device Grant 7,977,787 - Shimizu , et al. July 12, 2	2011-07-12
Semiconductor Device And Method Of Manufacturing The Same App 20110053348 - Akiyama; Hajime	2011-03-03
Semiconductor device and method of manufacturing the same Grant 7,851,873 - Akiyama December 14, 2	2010-12-14
Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage Grant 7,777,279 - Hatade , et al. August 17, 2	2010-08-17
Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage Grant 7,545,005 - Hatade , et al. June 9, 2	2009-06-09
Dielectric Isolation Type Semiconductor Device And Manufacturing Method Therefor App 20090140377 - Akiyama; Hajime	2009-06-04
Semiconductor Device And Method Of Manufacturing The Same App 20090127637 - AKIYAMA; Hajime	2009-05-21
Semiconductor Device Manufacturing Apparatus, Semiconductor Device Manufacturing Method And Semiconductor Device App 20090096091 - Shimizu; Kazuhiro ; et al.	2009-04-16
Dielectric isolation type semiconductor device and manufacturing method therefor Grant 7,485,943 - Akiyama February 3, 2	2009-02-03
Semiconductor device manufacturing apparatus, semiconductor device manufacturing method and semiconductor device Grant 7,481,885 - Shimizu , et al. January 27, 2	2009-01-27
Semiconductor Device Capable Of Avoiding Latchup Breakdown Resulting From Negative Variation Of Floating Offset Voltage App 20080272440 - HATADE; Kazunari ; et al.	2008-11-06
Semiconductor Device Capable Of Avoiding Latchup Breakdown Resulting From Negative Variation Of Floating Offset Voltage App 20080265334 - HATADE; Kazunari ; et al.	2008-10-30
Dielectric isolation type semiconductor device Grant 7,417,296 - Akiyama August 26, 2	2008-08-26
Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage Grant 7,408,228 - Hatade , et al. August 5, 2	2008-08-05
Semiconductor Device Capable Of Avoiding Latchup Breakdown Resulting From Negative Variation Of Floating Offset Voltage App 20070114614 - Hatade; Kazunari ; et al.	2007-05-24
Semiconductor device manufacturing apparatus, semiconductor device manufacturing method and semiconductor device App 20070072394 - Shimizu; Kazuhiro ; et al.	2007-03-29
Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage Grant 7,190,034 - Hatade , et al. March 13, 2	2007-03-13
Dielectric isolation type semiconductor device and method for manufacturing the same Grant 7,135,752 - Akiyama , et al. November 14, 2	2006-11-14
Dielectric isolation type semiconductor device and manufacturing method therefor App 20060249807 - Akiyama; Hajime	2006-11-09
Dielectric isolation type semiconductor device and method for manufacturing the same Grant 7,125,780 - Akiyama , et al. October 24, 2	2006-10-24
Dielectric isolation type semiconductor device and method for manufacturing the same App 20060138586 - Akiyama; Hajime ; et al.	2006-06-29
Dielectric separation type semiconductor device and method of manufacturing the same Grant 6,992,363 - Akiyama , et al. January 31, 2	2006-01-31
Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage App 20060011960 - Hatade; Kazunari ; et al.	2006-01-19
Dielectric isolation type semiconductor device App 20050253170 - Akiyama, Hajime	2005-11-17
Dielectric isolation type semiconductor device and method for manufacturing the same App 20050127470 - Akiyama, Hajime ; et al.	2005-06-16
Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage App 20040189353 - Hatade, Kazunari ; et al.	2004-09-30
Dielectric separation type semiconductor device and method of manufacturing the same App 20040119132 - Akiyama, Hajime ; et al.	2004-06-24
Power semiconductor device for power integrated circuit device Grant 6,603,176 - Akiyama August 5, 2	2003-08-05
Polyurethane foam, process for producing the same, and foam forming composition Grant 6,455,606 - Kaku , et al. September 24, 2	2002-09-24
Polyurethane Foam, Process For Producing The Same, And Foam Forming Composition App 20020052425 - KAKU, MOTONAO ; et al.	2002-05-02
Semiconductor device App 20020043699 - Akiyama, Hajime	2002-04-18
Semiconductor device having lateral high breakdown voltage element Grant 6,307,232 - Akiyama , et al. October 23, 2	2001-10-23
Isolation structure and semiconductor device including the isolation structure Grant 6,246,101 - Akiyama June 12, 2	2001-06-12
Semiconductor device with first and second elements formed on first and second portions Grant 6,037,634 - Akiyama March 14, 2	2000-03-14
High withstand voltage semiconductor device and manufacturing method thereof Grant 5,804,864 - Akiyama September 8, 1	1998-09-08
Method of manufacturing an insulated gate bipolar transistor Grant 5,292,672 - Akiyama , et al. March 8, 1	1994-03-08
Insulated gate bipolar transistor and method of manufacturing the same Grant 5,182,626 - Akiyama , et al. January 26, 1	1993-01-26
Insulated gate bipolar transistor Grant 5,160,985 - Akiyama November 3, 1	1992-11-03
Coating composition and plastisol composition, and articles coated therewith Grant 5,130,402 - Akiyama , et al. July 14, 1	1992-07-14

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