Akiba; Hideki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Akiba; Hideki.The latest application filed is for "base-attached encapsulant for semiconductor encapsulation, semiconductor apparatus, and method for manufacturing semiconductor apparatus".

Company Profile

3.17.26

Akiba; Hideki - Annaka JP
AKIBA; Hideki - Annaka-shi JP
Akiba; Hideki - Gunma-ken JP
Akiba; Hideki - Usui-gun JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Surface-modified glass fiber film Grant 10,669,197 - Akahane , et al.	2020-06-02
Base-attached encapsulant for semiconductor encapsulation, semiconductor apparatus Grant 10,242,924 - Nakamura , et al.	2019-03-26
Method for manufacturing semiconductor apparatus using a base-attached encapsulant Grant 10,177,059 - Nakamura , et al. J	2019-01-08
Base-attached Encapsulant For Semiconductor Encapsulation, Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus App 20180025958 - NAKAMURA; Tomoaki ; et al.	2018-01-25
Electromagnetic wave shielding support base-attached encapsulant, encapsulated substrate having semicondutor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, and semiconductor apparatus Grant 9,865,518 - Akiba , et al. January 9, 2	2018-01-09
Base-attached Encapsulant For Semiconductor Encapsulation, Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus App 20170330813 - NAKAMURA; Tomoaki ; et al.	2017-11-16
Vacuum Laminating Apparatus And Method For Manufacturing Semiconductor Apparatus App 20170282527 - AKIBA; Hideki ; et al.	2017-10-05
Method For Manufacturing Semiconductor Apparatus And Semiconductor Apparatus App 20170110415 - NAKAMURA; Tomoaki ; et al.	2017-04-20
Base-attached Encapsulant For Semiconductor Encapsulation, Method For Manufacturing Base-attached Encapsulant For Semiconductor Encapsulation, And Method For Manufacturing Semiconductor Apparatus App 20170098551 - NAKAMURA; Tomoaki ; et al.	2017-04-06
Encapsulant with base for use in semiconductor encapsulation, semiconductor apparatus, and method for manufacturing semiconductor apparatus Grant 9,449,856 - Nakamura , et al. September 20, 2	2016-09-20
Semiconductor apparatus and method for producing the same Grant 9,401,290 - Shiobara , et al. July 26, 2	2016-07-26
Method For Manufacturing Semiconductor Apparatus And Semiconductor Apparatus App 20160141268 - NAKAMURA; Tomoaki ; et al.	2016-05-19
Electromagnetic Wave Shielding Support Base-attached Encapsulant, Encapsulated Substrate Having Semicondutor Devices Mounted Thereon, Encapsulated Wafer Having Semiconductor Devices Formed Thereon, And Semiconductor Apparatus App 20160133579 - AKIBA; Hideki ; et al.	2016-05-12
Support base-attached encapsulant, encapsulated substrate having semiconductor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus Grant 9,312,197 - Akiba , et al. April 12, 2	2016-04-12
Fiber-containing resin substrate, device-mounting substrate and device-forming wafer, semiconductor apparatus, and method for producing semiconductor apparatus Grant 9,287,174 - Sekiguchi , et al. March 15, 2	2016-03-15
Electromagnetic Wave Shielding Sheet And Semiconductor Apparatus App 20160044839 - AKAHANE; Saiko ; et al.	2016-02-11
Fiber-containing Resin Substrate, Device-mounting Substrate And Device-forming Wafer, Semiconductor Apparatus, And Method For Producing Semiconductor Apparatus App 20160043012 - SEKIGUCHI; Susumu ; et al.	2016-02-11
Support Base-attached Encapsulant, Encapsulated Substrate Having Semiconductor Devices Mounted Thereon, Encapsulated Wafer Having Semiconductor Devices Formed Thereon, Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus App 20160035638 - AKIBA; Hideki ; et al.	2016-02-04
Method of manufacturing semiconductor apparatus and semiconductor apparatus Grant 9,129,976 - Akiba , et al. September 8, 2	2015-09-08
Encapsulant, encapsulated substrate having semiconductor devices mounting thereon, encapsulated wafer having semiconductor devices forming thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus Grant 9,129,912 - Akiba , et al. September 8, 2	2015-09-08
Vacuum Laminating Apparatus And Method For Manufacturing Semiconductor Apparatus App 20150235871 - AKIBA; Hideki ; et al.	2015-08-20
Surface-modified Glass Fiber Film App 20150197885 - AKAHANE; Saiko ; et al.	2015-07-16
Encapsulant With Base For Use In Semiconductor Encapsulation, Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus App 20150028497 - NAKAMURA; Tomoaki ; et al.	2015-01-29
Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus Grant 8,872,358 - Shiobara , et al. October 28, 2	2014-10-28
Sealant Laminated Composite, Sealed Semiconductor Devices Mounting Substrate, Sealed Semiconductor Devices Forming Wafer, Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus App 20140264956 - SHIOBARA; Toshio ; et al.	2014-09-18
Encapsulant Equipped With Supporting Substrate, Encapsulated Substrate Having Semiconductor Devices Mounting Thereon, Encapsulated Wafer Having Semiconductor Devices Forming Thereon, Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus App 20140138857 - AKIBA; Hideki ; et al.	2014-05-22
Fiber-containing Resin Substrate, Device-mounting Substrate And Device-forming Wafer, Semiconductor Apparatus, And Method For Producing Semiconductor Apparatus App 20140138856 - SEKIGUCHI; Susumu ; et al.	2014-05-22
Method Of Manufacturing Semiconductor Apparatus And Semiconductor Apparatus App 20140091483 - AKIBA; Hideki ; et al.	2014-04-03
Semiconductor Apparatus And Method For Producing The Same App 20130241087 - SHIOBARA; Toshio ; et al.	2013-09-19
Sealant Laminated Composite, Sealed Semiconductor Devices Mounting Substrate, Sealed Semiconductor Devices Forming Wafer, Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus App 20130200534 - SHIOBARA; Toshio ; et al.	2013-08-08
Liquid Epoxy Resin Composition And Semiconductor Device App 20130197129 - AKIBA; Hideki ; et al.	2013-08-01
Resin resolution composition, polyimide resin, and semiconductor device Grant 8,034,893 - Akiba , et al. October 11, 2	2011-10-11
Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device Grant 7,714,080 - Akiba , et al. May 11, 2	2010-05-11
Partial block polyimide-polysiloxane copolymer, making method, and resin composition comprising the copolymer Grant 7,683,152 - Akiba , et al. March 23, 2	2010-03-23
Resin solution composition, polyimide resin, and semiconductor device App 20070066796 - Akiba; Hideki ; et al.	2007-03-22
Wafer dicing/die bonding sheet Grant 7,147,920 - Shiobara , et al. December 12, 2	2006-12-12
Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device App 20060199923 - Akiba; Hideki ; et al.	2006-09-07
Conductive resin composition Grant 7,026,382 - Akiba , et al. April 11, 2	2006-04-11
Partial block polyimide-polysiloxane copolymer, making method , and resin composition comprising the copolymer App 20050261456 - Akiba, Hideki ; et al.	2005-11-24
Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition Grant 6,949,619 - Ichiroku , et al. September 27, 2	2005-09-27
Wafer dicing/die bonding sheet App 20040105990 - Shiobara, Toshio ; et al.	2004-06-03
Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition App 20040019174 - Ichiroku, Nobuhiro ; et al.	2004-01-29
Conductive resin composition App 20030216505 - Akiba, Hideki ; et al.	2003-11-20

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