Akhavain; Mohammad
Patent Applications and Registrations
Patent applications and USPTO patent grants for Akhavain; Mohammad.The latest application filed is for "connection pad layouts".
- Akhavain; Mohammad - Escondido CA
- Akhavain; Mohammad - San Diego CA
| Patent | Date |
|---|---|
| Method of making a fluid ejection head for a fluid ejection device Grant 7,480,994 - Wood, III , et al. January 27, 2 | 2009-01-27 |
| Methods for forming and protecting electrical interconnects and resultant assemblies Grant 7,338,149 - Akhavain , et al. March 4, 2 | 2008-03-04 |
| Connection Pad Layouts App 20070169342 - Lassar; Noah ; et al. | 2007-07-26 |
| Fluid ejection head assembly App 20070153048 - Wood; Benjamin H. III ; et al. | 2007-07-05 |
| Connection pad layouts Grant 7,211,736 - Lassar , et al. May 1, 2 | 2007-05-01 |
| Fluid ejection head assembly Grant 7,188,925 - Wood, III , et al. March 13, 2 | 2007-03-13 |
| Methods and systems for forming a die package Grant 7,103,969 - Bretl , et al. September 12, 2 | 2006-09-12 |
| Method of forming an electrical connection between electrical leads of a tab circuit and electrical contact bumps Grant 6,983,539 - Akhavain , et al. January 10, 2 | 2006-01-10 |
| Methods for forming and protecting electrical interconnects and resultant assemblies App 20050248617 - Akhavain, Mohammad ; et al. | 2005-11-10 |
| Edge-sealed substrates and methods for effecting the same Grant 6,951,778 - Akhavain , et al. October 4, 2 | 2005-10-04 |
| Fluid ejection head assembly App 20050168513 - Wood, Benjamin H. III ; et al. | 2005-08-04 |
| Methods for forming and protecting electrical interconnects and resultant assemblies Grant 6,913,343 - Akhavain , et al. July 5, 2 | 2005-07-05 |
| Connection pad layouts App 20050094382 - Lassar, Noah ; et al. | 2005-05-05 |
| Electrical circuit for printhead assembly Grant 6,843,552 - McElfresh , et al. January 18, 2 | 2005-01-18 |
| Methods for forming and protecting electrical interconnects and resultant assemblies App 20040218009 - Akhavain, Mohammad ; et al. | 2004-11-04 |
| Methods and systems for forming a die package App 20040128831 - Bretl, Frank J. ; et al. | 2004-07-08 |
| Substrate for fluid ejection devices Grant 6,705,705 - Horvath , et al. March 16, 2 | 2004-03-16 |
| Methods and systems for forming a die package Grant 6,698,092 - Bretl , et al. March 2, 2 | 2004-03-02 |
| Electrical circuit for printhead assembly App 20030202047 - McElfresh, David ; et al. | 2003-10-30 |
| Electrical circuit for wide-array inkjet printhead assembly Grant 6,557,976 - McElfresh , et al. May 6, 2 | 2003-05-06 |
| Joining of different materials of carrier for printhead dies App 20030081058 - McElfresh, David K. ; et al. | 2003-05-01 |
| Methods and systems for forming a die package App 20030081647 - Bretl, Frank J. ; et al. | 2003-05-01 |
| Inkjet printhead assembly having planarized mounting layer for printhead dies Grant 6,543,880 - Akhavain , et al. April 8, 2 | 2003-04-08 |
| Connection of electrical contacts utilizing a combination laser and fiber optic push connect system App 20030041455 - Akhavain, Mohammad ; et al. | 2003-03-06 |
| Printhead die alignment for wide-array inkjet printhead assembly Grant 6,450,614 - Scheffelin , et al. September 17, 2 | 2002-09-17 |
| Electrical Circuit For Wide-array Inkjet Printhead Assembly App 20020109751 - McElfresh, David ; et al. | 2002-08-15 |
| Hybrid carrier for wide-array inkjet printhead assembly Grant 6,431,683 - Ho , et al. August 13, 2 | 2002-08-13 |
| Reference datums for inkjet printhead assembly Grant 6,428,141 - Mc Elfresh , et al. August 6, 2 | 2002-08-06 |
| Coplanar mounting of printhead dies for wide-array inkjet printhead assembly Grant 6,409,307 - Akhavain , et al. June 25, 2 | 2002-06-25 |
| Carrier positioning for wide-array inkjet printhead assembly Grant 6,350,013 - Scheffelin , et al. February 26, 2 | 2002-02-26 |
| Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding App 20020000427 - Akhavain, Mohammad ; et al. | 2002-01-03 |
| Method of fabricating integrated circuit module Grant 5,341,564 - Akhavain , et al. August 30, 1 | 1994-08-30 |
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