Akerling; Gershon
Patent Applications and Registrations
Patent applications and USPTO patent grants for Akerling; Gershon.The latest application filed is for "method of making a low mass foam electrical structure".
- Akerling; Gershon - Culver City CA
| Patent | Date |
|---|---|
| Method of making a low mass foam electrical structure Grant 11,056,760 - Mass , et al. July 6, 2 | 2021-07-06 |
| Method Of Making A Low Mass Foam Electrical Structure App 20190081381 - Mass; Steven J. ; et al. | 2019-03-14 |
| Method of making a low mass foam electrical structure Grant 10,122,063 - Mass , et al. November 6, 2 | 2018-11-06 |
| Waveguide and semiconductor packaging Grant 9,960,204 - Zhang , et al. May 1, 2 | 2018-05-01 |
| Waveguide And Semiconductor Packaging App 20170018597 - Zhang; Chunbo ; et al. | 2017-01-19 |
| Waveguide and semiconductor packaging Grant 9,478,458 - Zhang , et al. October 25, 2 | 2016-10-25 |
| Method Of Making A Low Mass Foam Electrical Structure App 20160149286 - Mass; Steven J. ; et al. | 2016-05-26 |
| RF transmission line disposed within a conductively plated cavity located in a low mass foam housing Grant 9,293,800 - Mass , et al. March 22, 2 | 2016-03-22 |
| Waveguide And Semiconductor Packaging App 20140254979 - Zhang; Chunbo ; et al. | 2014-09-11 |
| Low Mass Foam Electrical Structure App 20120152454 - Mass; Steven J. ; et al. | 2012-06-21 |
| Method for packaging integrated circuit chips Grant 7,135,779 - Anderson , et al. November 14, 2 | 2006-11-14 |
| High performance vias for vertical IC packaging Grant 6,936,913 - Akerling , et al. August 30, 2 | 2005-08-30 |
| Method for packaging integrated circuit chips App 20040248342 - Anderson, James ; et al. | 2004-12-09 |
| Low thermal expansion adhesives and encapsulants for cryogenic and high power density electronic and photonic device assembly and packaging App 20040214377 - Starkovich, John A. ; et al. | 2004-10-28 |
| High power chip scale package Grant 6,768,189 - Anderson , et al. July 27, 2 | 2004-07-27 |
| High performance vias for vertical IC packaging App 20040113264 - Akerling, Gershon ; et al. | 2004-06-17 |
| Chip-to-board connection assembly and method therefor Grant 6,219,254 - Akerling , et al. April 17, 2 | 2001-04-17 |
| Method for parallel alignment of a chip to substrate Grant 6,146,912 - Tighe , et al. November 14, 2 | 2000-11-14 |
| Process of fabricating high frequency connections to high temperature superconductor circuits Grant 6,055,723 - Akerling , et al. May 2, 2 | 2000-05-02 |
| Stripline flexible cable to printed circuit board attachment system Grant 6,055,722 - Tighe , et al. May 2, 2 | 2000-05-02 |
| Cryogenic flex cable connector Grant 5,970,608 - Tighe , et al. October 26, 1 | 1999-10-26 |
| Cryogenic flex cable connector Grant 5,924,875 - Tighe , et al. July 20, 1 | 1999-07-20 |
| Reworkable microelectronic multi-chip module Grant 5,920,464 - Yokoyama , et al. July 6, 1 | 1999-07-06 |
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