AKAZAWA; Koji
Patent Applications and Registrations
Patent applications and USPTO patent grants for AKAZAWA; Koji.The latest application filed is for "adhesion method, adhesion-structure, and adhesion kit".
- AKAZAWA; Koji - Osaka JP
- AKAZAWA; Koji - Ibaraki-shi Osaka
- Akazawa; Koji - Ibaraki JP
| Patent | Date |
|---|---|
| Adhesion Method, Adhesion-structure, And Adhesion Kit App 20210403759 - YOSHIDA; Akiko ; et al. | 2021-12-30 |
| Adhesion method, adhesion-structure, and adhesion kit Grant 11,174,415 - Yoshida , et al. November 16, 2 | 2021-11-16 |
| Electrically Debondable Adhesive Composition, Adhesive Sheet, And Adhered Body App 20200002581 - AKAMATSU; Kaori ; et al. | 2020-01-02 |
| Adhesion Method, Adhesion-structure, And Adhesion Kit App 20180327635 - YOSHIDA; Akiko ; et al. | 2018-11-15 |
| Optical-semiconductor device Grant 9,190,584 - Kondo , et al. November 17, 2 | 2015-11-17 |
| Optical-semiconductor Encapsulating Material App 20140106487 - FUJIOKA; Kazuya ; et al. | 2014-04-17 |
| Optical-semiconductor Device App 20140057374 - KONDO; Takashi ; et al. | 2014-02-27 |
| Optical semiconductor device Grant 8,492,791 - Ozaki , et al. July 23, 2 | 2013-07-23 |
| Optical Semiconductor Device App 20120153345 - Ozaki; Takashi ; et al. | 2012-06-21 |
| Optical-semiconductor Device App 20110186893 - KONDO; Takashi ; et al. | 2011-08-04 |
| Kit For Optical Semiconductor Encapsulation App 20110079929 - MATSUDA; Hirokazu ; et al. | 2011-04-07 |
| Optical-semiconductor Encapsulating Material App 20110079816 - FUJIOKA; Kazuya ; et al. | 2011-04-07 |
| Sheet For Photosemiconductor Encapsulation App 20100209670 - SUEHIRO; Ichiro ; et al. | 2010-08-19 |
| Re-release adhesive and re-release adhesive sheet Grant 7,641,966 - Hashimoto , et al. January 5, 2 | 2010-01-05 |
| Laminated sheet Grant 7,521,122 - Noro , et al. April 21, 2 | 2009-04-21 |
| Laminated sheet App 20050008873 - Noro, Hiroshi ; et al. | 2005-01-13 |
| Re-release adhesive and re-release adhesive sheet App 20020091173 - Hashimoto, Kouichi ; et al. | 2002-07-11 |
| Dicing-die bonding film Grant 5,476,565 - Akada , et al. December 19, 1 | 1995-12-19 |
| Dicing-die bonding film Grant 5,304,418 - Akada , et al. April 19, 1 | 1994-04-19 |
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