Akashi; Takahiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Akashi; Takahiro.The latest application filed is for "epoxy resin composition and resin-encapsulated substrate".

Company Profile

0.4.7

Akashi; Takahiro - Hyogo JP
Akashi; Takahiro - Yokohama JP
Akashi; Takahiro - Ichihara JP
Akashi; Takahiro - Yokohama-shi JP
Akashi; Takahiro - Ichihara-shi JP
Akashi; Takahiro - Chiba JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor chip-encapsulating resin composition containing epoxy resin, and semiconductor package including a cured product of the semiconductor-chip-encapsulating resin composition Grant 11,244,878 - Nishidono , et al. February 8, 2	2022-02-08
Epoxy Resin Composition And Resin-encapsulated Substrate App 20210292473 - AKASHI; Takahiro ; et al.	2021-09-23
Semiconductor-chip-encapsulating Resin Composition And Semiconductor Package App 20210183719 - NISHIDONO; Kyoko ; et al.	2021-06-17
Film or laminate comprising ethylene-based resin or ethylene-based resin composition Grant 8,299,193 - Suzuki , et al. October 30, 2	2012-10-30
Ethylene polymer and use thereof Grant 8,129,489 - Okamoto , et al. March 6, 2	2012-03-06
Ethylene polymer and application thereof to moldings Grant 7,700,708 - Takahashi , et al. April 20, 2	2010-04-20
Film Or Laminate Comprising Ethylene-based Resin Or Ethylene-based Resin Composition App 20090291285 - Suzuki; Masao ; et al.	2009-11-26
Ethylene Polymer, and Thermoplastic Resin Composition Comprising the Same, and Molded Product Obtained Therefrom App 20090270580 - Satoh; Yasuo ; et al.	2009-10-29
Ethylenic Polymer and Molded Article Obtained Therefrom App 20090018299 - Tasaki; Tsutomu ; et al.	2009-01-15
Ethylene Polymer and Use Thereof App 20070244286 - Okamoto; Masahiko ; et al.	2007-10-18
Ethylene polymer and application thereof to moldings App 20060189775 - Takahashi; Mamoru ; et al.	2006-08-24

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