loadpatents
name:-0.006134033203125
name:-0.0088891983032227
name:-0.0005040168762207
Akashi; Naohisa Patent Filings

Akashi; Naohisa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Akashi; Naohisa.The latest application filed is for "thermoplastic resin composition, resin molded article, and method for manufacturing resin molded article having a plated layer".

Company Profile
0.6.5
  • Akashi; Naohisa - Tokyo JP
  • Akashi; Naohisa - Hofu N/A JP
  • Akashi; Naohisa - Hofu-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity

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