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Akasaka; Kouji Patent Filings

Akasaka; Kouji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Akasaka; Kouji.The latest application filed is for "method and apparatus for producing a molded article with a laminated structure".

Company Profile
0.4.5
  • Akasaka; Kouji - Tokyo JP
  • Akasaka, Kouji - Gunma JP
  • Akasaka; Kouji - Nara JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for producing a molded article with a laminated structure
Grant 8,313,683 - Baba , et al. November 20, 2
2012-11-20
Method And Apparatus For Producing A Molded Article With A Laminated Structure
App 20100201017 - Baba; Hideki ;   et al.
2010-08-12
Foamed molding
App 20050093192 - Koike, Takashi ;   et al.
2005-05-05
Composite molding
Grant 6,861,133 - Koike , et al. March 1, 2
2005-03-01
Impact absorbing member for vehicle
Grant 6,706,365 - Akasaka , et al. March 16, 2
2004-03-16
Method and apparatus for electronic memo processing for integrally managing document including paper document and electronic memo added to the document
Grant 6,396,598 - Kashiwagi , et al. May 28, 2
2002-05-28
Composite molding
App 20020061383 - Koike, Takashi ;   et al.
2002-05-23
Impact absorbing member for vehicle
App 20020054977 - Akasaka, Kouji ;   et al.
2002-05-09
Foamed molding
App 20020054986 - Koike, Takashi ;   et al.
2002-05-09

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