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Electronic component and electronic device
Grant 10,062,658 - Sakuyama , et al. August 28, 2 | 2018-08-28 |
Electronic component and electronic device
Grant 10,056,342 - Sakuyama , et al. August 21, 2 | 2018-08-21 |
Electronic Part, Electronic Device, And Electronic Apparatus
App 20170250153 - Kikuchi; Ryo ; et al. | 2017-08-31 |
Semiconductor device and manufacturing method thereof
Grant 9,472,527 - Akamatsu , et al. October 18, 2 | 2016-10-18 |
Optical device and optical module
Grant 9,235,001 - Sekiguchi , et al. January 12, 2 | 2016-01-12 |
Terminal Structure, Semiconductor Device, And Terminal Forming Method
App 20150371962 - AKAMATSU; TOSHIYA | 2015-12-24 |
Optical Device And Optical Module
App 20150323738 - Sekiguchi; Shigeaki ; et al. | 2015-11-12 |
Electronic Component And Electronic Device
App 20150311171 - SAKUYAMA; Seiki ; et al. | 2015-10-29 |
Semiconductor Device And Manufacturing Method Thereof
App 20150221607 - AKAMATSU; TOSHIYA ; et al. | 2015-08-06 |
Circuit board, semiconductor device, and method of manufacturing semiconductor device
Grant 8,952,271 - Furuyama , et al. February 10, 2 | 2015-02-10 |
Semiconductor Device, Electronic Device, And Semiconductor Device Manufacturing Method
App 20150024555 - SHIMIZU; Kozo ; et al. | 2015-01-22 |
Semiconductor device, electronic device, and semiconductor device manufacturing method
Grant 8,901,751 - Shimizu , et al. December 2, 2 | 2014-12-02 |
Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same
Grant 8,740,047 - Sakuyama , et al. June 3, 2 | 2014-06-03 |
Circuit Board, Semiconductor Device, And Method Of Manufacturing Semiconductor Device
App 20140103097 - Furuyama; Masaharu ; et al. | 2014-04-17 |
Semiconductor device, method of manufacturing semiconductor device, and electronic device
Grant 8,692,386 - Akamatsu April 8, 2 | 2014-04-08 |
Solder, soldering method, and semiconductor device
Grant 8,673,762 - Akamatsu , et al. March 18, 2 | 2014-03-18 |
Method Of Manufacturing Electronic Apparatus, Electronic Component-mounting Board, And Method Of Manufacturing The Same
App 20140008114 - Sakuyama; Seiki ; et al. | 2014-01-09 |
Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same
Grant 8,556,157 - Sakuyama , et al. October 15, 2 | 2013-10-15 |
Electronic Component And Electronic Device
App 20130164956 - SAKUYAMA; Seiki ; et al. | 2013-06-27 |
Semiconductor Device, Electronic Device, And Semiconductor Device Manufacturing Method
App 20130087912 - SHIMIZU; Kozo ; et al. | 2013-04-11 |
Semiconductor Device, Method Of Manufacturing Semiconductor Device, And Electronic Device
App 20120193782 - Akamatsu; Toshiya | 2012-08-02 |
Solder, Soldering Method, And Semiconductor Device
App 20120193800 - Akamatsu; Toshiya ; et al. | 2012-08-02 |
Method Of Manufacturing Electronic Apparatus, Electronic Component-mounting Board, And Method Of Manufacturing The Same
App 20110220398 - Sakuyama; Seiki ; et al. | 2011-09-15 |
Mounting method of semiconductor element using outside connection projection electyrode and manufacturing method of semiconductor device using outside connection projection electrode
Grant 7,879,713 - Fujimori , et al. February 1, 2 | 2011-02-01 |
Soldering Flux And Method For Bonding Semiconductor Element
App 20100218853 - AKAMATSU; Toshiya ; et al. | 2010-09-02 |
Soldering flux and method for bonding semiconductor element
Grant 7,743,966 - Akamatsu , et al. June 29, 2 | 2010-06-29 |
Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same
Grant 7,604,152 - Ochiai , et al. October 20, 2 | 2009-10-20 |
Circuit Board, Semiconductor Device, And Method Of Manufacturing Semiconductor Device
App 20090090543 - FURUYAMA; Masaharu ; et al. | 2009-04-09 |
Mounting method of semiconductor element and manufacturing method of semiconductor device
App 20080124834 - Fujimori; Joji ; et al. | 2008-05-29 |
Soldering flux and method for bonding semiconductor element
App 20070221710 - Akamatsu; Toshiya ; et al. | 2007-09-27 |
Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same
App 20070090171 - Ochiai; Masayuki ; et al. | 2007-04-26 |
Substrate with terminal pads having respective single solder bumps formed thereon
App 20050062157 - Karasawa, Kazuaki ; et al. | 2005-03-24 |
Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof
App 20040209453 - Akamatsu, Toshiya ; et al. | 2004-10-21 |
Method for mounting electronic part and paste material
Grant 6,796,025 - Imamura , et al. September 28, 2 | 2004-09-28 |
Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof
Grant 6,764,938 - Akamatsu , et al. July 20, 2 | 2004-07-20 |
Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof
Grant 6,608,381 - Akamatsu , et al. August 19, 2 | 2003-08-19 |
Method for mounting electronic part and paste material
App 20020185309 - Imamura, Kazuyuki ; et al. | 2002-12-12 |
Integrated Electronic Device Having Flip-chip Connection With Circuit Board And Fabrication Method Thereof
App 20020050404 - AKAMATSU, TOSHIYA ; et al. | 2002-05-02 |
Solder bump transfer plate
Grant 6,136,047 - Karasawa , et al. October 24, 2 | 2000-10-24 |
Method of forming solder bumps onto an integrated circuit device
Grant 6,008,071 - Karasawa , et al. December 28, 1 | 1999-12-28 |
Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof
Grant 5,611,481 - Akamatsu , et al. March 18, 1 | 1997-03-18 |
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