Akahoshi; Tomoyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Akahoshi; Tomoyuki.The latest application filed is for "capacitor-embedded substrate and electronic apparatus".

Company Profile

10.12.18

Akahoshi; Tomoyuki - Atsugi JP
Akahoshi; Tomoyuki - Kawasaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Circuit board, method of manufacturing circuit board, and electronic device Grant 11,317,520 - Furuyama , et al. April 26, 2	2022-04-26
Circuit board, method for manufacturing circuit board, and electronic device Grant 10,896,871 - Akahoshi , et al. January 19, 2	2021-01-19
Capacitor-embedded Substrate And Electronic Apparatus App 20200245463 - Kind Code	2020-07-30
Capacitor built-in multilayer wiring substrate and manufacturing method thereof Grant 10,701,808 - Akahoshi , et al.	2020-06-30
Circuit Board And Method Of Manufacturing Circuit Board App 20190306982 - Nagaoka; Hideaki ; et al.	2019-10-03
Circuit Substrate And Method For Fabricating Circuit Substrate App 20190306981 - Furuyama; Masaharu ; et al.	2019-10-03
Capacitor Built-in Multilayer Wiring Substrate And Manufacturing Method Thereof App 20190289718 - Akahoshi; Tomoyuki ; et al.	2019-09-19
Method of manufacturing board Grant 10,396,020 - Fukui , et al. A	2019-08-27
Capacitor built-in multilayer wiring substrate and manufacturing method thereof Grant 10,362,677 - Akahoshi , et al.	2019-07-23
Circuit Board, Method Of Manufacturing Circuit Board, And Electronic Device App 20190215963 - Akahoshi; Tomoyuki ; et al.	2019-07-11
Circuit Board, Method For Manufacturing Circuit Board, And Electronic Device App 20190051598 - AKAHOSHI; Tomoyuki ; et al.	2019-02-14
Circuit Board, Method Of Manufacturing Circuit Board, And Electronic Device App 20190053385 - Furuyama; Masaharu ; et al.	2019-02-14
Capacitor Built-in Multilayer Wiring Substrate And Manufacturing Method Thereof App 20180332707 - Akahoshi; Tomoyuki ; et al.	2018-11-15
Board And Method Of Manufacturing Board App 20180315687 - FUKUI; Kei ; et al.	2018-11-01
Wiring board and electronic apparatus Grant 9,491,860 - Akahoshi November 8, 2	2016-11-08
Wiring board and design method for wiring board Grant 9,179,539 - Akahoshi November 3, 2	2015-11-03
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20150214104 - AKAHOSHI; Tomoyuki	2015-07-30
Wiring Board, Method For Fabricating The Same, And Electronic Apparatus App 20150189751 - AKAHOSHI; Tomoyuki ; et al.	2015-07-02
Wiring Board And Electronic Apparatus App 20150000967 - AKAHOSHI; Tomoyuki	2015-01-01
Wiring Board And Design Method For Wiring Board App 20140202752 - AKAHOSHI; Tomoyuki	2014-07-24
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20130341765 - AKAHOSHI; Tomoyuki	2013-12-26
Wiring Board App 20100244274 - ISHITSUKA; Takeshi ; et al.	2010-09-30
Optical module method of manufacturing the same Grant 7,565,044 - Akahoshi , et al. July 21, 2	2009-07-21
Optical module and method of manufacturing the same Grant 7,522,788 - Akahoshi , et al. April 21, 2	2009-04-21
Optical Module Method Of Manufacturing The Same App 20080199129 - AKAHOSHI; Tomoyuki ; et al.	2008-08-21
Optical Module And Method Of Manufacturing The Same App 20080166086 - AKAHOSHI; Tomoyuki ; et al.	2008-07-10
Method for production of optical module and optical module Grant 7,097,366 - Aoki , et al. August 29, 2	2006-08-29
Method for production of optical module and optical module App 20050069274 - Aoki, Tsuyoshi ; et al.	2005-03-31
Inkjet head formed of divided pressure-chamber plate, method for manufacturing the same, and recording device having the inkjet head Grant 6,382,780 - Watanabe , et al. May 7, 2	2002-05-07
Water-repellent coating and method for forming same on the surface of liquid jet Grant 6,341,836 - Koike , et al. January 29, 2	2002-01-29

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