| Patent | Date |
|---|
Solder, aluminum wire body and motor using the same
Grant 9,789,568 - Aoyagi , et al. October 17, 2 | 2017-10-17 |
Semiconductor device, manufacturing method of semiconductor device, semiconductor manufacturing and inspecting apparatus, and inspecting apparatus
Grant 9,362,184 - Kato , et al. June 7, 2 | 2016-06-07 |
Method for Forming Aluminide Coating Film on Base Material
App 20160024637 - NAKANO; Hiroshi ; et al. | 2016-01-28 |
Electrode for electrochemical measurement, electrolysis cell for electrochemical measurement, analyzer for electrochemical measurement, and methods for producing same
Grant 9,234,861 - Kanemoto , et al. January 12, 2 | 2016-01-12 |
Semiconductor package having a metal member and a resin mold, which are bonded to a silane coupling agent and an intermediate layer of an oxide film
Grant 9,136,244 - Mabuchi , et al. September 15, 2 | 2015-09-15 |
Power module and lead frame for power module
Grant 9,076,780 - Negishi , et al. July 7, 2 | 2015-07-07 |
Semiconductor Device, Manufacturing Method Of Semiconductor Device, Semiconductor Manufacturing And Inspecting Apparatus, And Inspecting Apparatus
App 20150104889 - KATO; Takahiko ; et al. | 2015-04-16 |
Suspended particle device, light control device using the same, and driving method
Grant 8,995,046 - Mori , et al. March 31, 2 | 2015-03-31 |
Semiconductor device, manufacturing method of semiconductor device, semiconductor manufacturing and inspecting apparatus, and inspecting apparatus
Grant 8,946,895 - Kato , et al. February 3, 2 | 2015-02-03 |
Solder, Aluminum Wire Body and Motor Using the Same
App 20140285039 - AOYAGI; Takuya ; et al. | 2014-09-25 |
Fine metal structure, process for producing the same, fine metal mold and device
Grant 8,741,380 - Yoshida , et al. June 3, 2 | 2014-06-03 |
Lithium-aluminum Battery
App 20140045055 - Nakano; Hiroshi ; et al. | 2014-02-13 |
Power Module And Lead Frame For Power Module
App 20130270684 - Negishi; Yoshinori ; et al. | 2013-10-17 |
Electrode For Electrochemical Measurement, Electrolysis Cell For Electrochemical Measurement, Analyzer For Electrochemical Measurement, And Methods For Producing Same
App 20130248378 - Kanemoto; Hiroshi ; et al. | 2013-09-26 |
Suspended Particle Device, Light Control Device Using The Same, And Driving Method
App 20130201549 - MORI; Shunsuke ; et al. | 2013-08-08 |
High corrosion resistant equipment for a plant
Grant 8,479,970 - Ishibashi , et al. July 9, 2 | 2013-07-09 |
Aluminum Electroplating Solution
App 20130168258 - Nakano; Hiroshi ; et al. | 2013-07-04 |
Method For Jointing Metal Member And Resin And Jointed Body Thereof
App 20130161807 - MABUCHI; Katsumi ; et al. | 2013-06-27 |
Fine pattern mold
Grant 8,387,255 - Ogino , et al. March 5, 2 | 2013-03-05 |
Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing method
Grant 8,366,903 - Kawamura , et al. February 5, 2 | 2013-02-05 |
High Corrosion Resistant Equipment For A Plant
App 20120321904 - Ishibashi; Ryo ; et al. | 2012-12-20 |
Magnetic recording medium, method for fabricating the same, and magnetic storage device
Grant 8,318,332 - Mabuchi , et al. November 27, 2 | 2012-11-27 |
Corrosion Control Method Of Metal
App 20120205010 - Mabuchi; Katsumi ; et al. | 2012-08-16 |
Fine Pattern Mold
App 20120067507 - OGINO; Masahiko ; et al. | 2012-03-22 |
Phase-separation-controlled polybutadiene resin composition and printed wiring board using the resin composition
Grant 8,097,545 - Amou , et al. January 17, 2 | 2012-01-17 |
Fine pattern mold
Grant 8,083,515 - Ogino , et al. December 27, 2 | 2011-12-27 |
Illuminating apparatus, method for fabricating the using the same and display apparatus using the same
Grant 8,022,431 - Kaneko , et al. September 20, 2 | 2011-09-20 |
Electronic Circuit Component And Method For Manufacturing Same
App 20110114368 - Nakano; Hiroshi ; et al. | 2011-05-19 |
Semiconductor device
Grant 7,944,026 - Koshiishi , et al. May 17, 2 | 2011-05-17 |
Metal structure and method of its production
Grant 7,922,887 - Haba , et al. April 12, 2 | 2011-04-12 |
Surface Treatment Method For Copper And Surface Treatment Method For Printed Wiring Board
App 20110036493 - Kawamura; Toshinori ; et al. | 2011-02-17 |
Polishing Slurry For Cmp
App 20110027994 - Mabuchi; Katsumi ; et al. | 2011-02-03 |
Electrode for use in electrochemical device, solid electrolyte/electrode assembly, and production method thereof
Grant 7,875,387 - Nakano , et al. January 25, 2 | 2011-01-25 |
Magnetic Recording Medium, Method For Fabricating The Same, And Magnetic Storage Device
App 20100323223 - MABUCHI; Katsumi ; et al. | 2010-12-23 |
Fine Metal Structure, Process for Producing the Same, Fine Metal Mold and Device
App 20100310773 - Yoshida; Hiroshi ; et al. | 2010-12-09 |
Copper Circuit Wiring Board And Method For Manufacturing The Same
App 20100181100 - NAKANO; Hiroshi ; et al. | 2010-07-22 |
Manufacturing method of printed wiring board as well as copper-clad laminate and treatment solutions used therefor
Grant 7,666,320 - Kawamura , et al. February 23, 2 | 2010-02-23 |
Lighting system and display apparatus using the same
Grant 7,661,866 - Kaneko , et al. February 16, 2 | 2010-02-16 |
Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish
Grant 7,638,564 - Amou , et al. December 29, 2 | 2009-12-29 |
Semiconductor Device, Manufacturing Method Of Semiconductor Device, Semiconductor Manufacturing And Inspecting Apparatus, And Inspecting Apparatus
App 20090218694 - KATO; Takahiko ; et al. | 2009-09-03 |
Electric plating method, electric plating apparatus, program for plating, recording medium, and manufacturing method and manufacturing apparatus for semiconductor device
Grant 7,579,275 - Nakano , et al. August 25, 2 | 2009-08-25 |
Cu-BASED WIRING MATERIAL AND ELECTRONIC COMPONENT USING THE SAME
App 20090200070 - KATO; Takahiko ; et al. | 2009-08-13 |
Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing method
App 20090084684 - Kawamura; Toshinori ; et al. | 2009-04-02 |
Production Method For Wiring And Vias
App 20090057156 - Haba; Toshio ; et al. | 2009-03-05 |
Lighting source unit, illuminating apparatus using the same and display apparatus using the same
Grant 7,478,925 - Hiyama , et al. January 20, 2 | 2009-01-20 |
Fine Pattern Mold and Method for Producing the Same
App 20080299247 - Ogino; Masahiko ; et al. | 2008-12-04 |
Wiring Board and Production Method Thereof
App 20080251387 - Haba; Toshio ; et al. | 2008-10-16 |
Printed Circuit Board and Method for Processing Printed Circuit Board
App 20080230512 - Arai; Kunio ; et al. | 2008-09-25 |
Semiconductor Device
App 20080164585 - Koshiishi; Kazutaka ; et al. | 2008-07-10 |
Polishing Slurry for Cmp
App 20080105651 - Mabuchi; Katsumi ; et al. | 2008-05-08 |
Phase-Separation-Controlled Polybutadiene Resin Composition and Printed Wiring Board Using the Resin Composition
App 20080090478 - Amou; Satoru ; et al. | 2008-04-17 |
Production Method Of Conductive Pattern
App 20070287289 - Haba; Toshio ; et al. | 2007-12-13 |
Manufacturing Method Of Semiconductor Device
App 20070202682 - YAMAMOTO; Kenichi ; et al. | 2007-08-30 |
Electrocatalyst for fuel cell-electrode, fuel cell using the same and method for producing electrocatalyst
App 20070178365 - Sugimasa; Masatoshi ; et al. | 2007-08-02 |
Abrasive-free polishing slurry and CMP process
App 20070147551 - Mabuchi; Katsumi ; et al. | 2007-06-28 |
Catalyst material and method of manufacturing the same and fuel cell using the same
Grant 7,235,324 - Sugimasa , et al. June 26, 2 | 2007-06-26 |
Catalyst material and method of manufacturing the same and fuel cell using the same
Grant 7,226,690 - Sugimasa , et al. June 5, 2 | 2007-06-05 |
High dielectric constant composite material and multilayer wiring board using the same
Grant 7,220,481 - Satsu , et al. May 22, 2 | 2007-05-22 |
Electrocatalyst for fuel cell-electrode, membrane-electrode assembly using the same and fuel cell
App 20070111085 - Sugimasa; Masatoshi ; et al. | 2007-05-17 |
Electroless copper plating solution, electroless copper plating process and production process of circuit board
App 20070079727 - Itabashi; Takeyuki ; et al. | 2007-04-12 |
Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish
App 20070077413 - Amou; Satoru ; et al. | 2007-04-05 |
Electrode for use in electrochemical device, solid electrolyte/electrode assembly, and production method thereof
App 20070059584 - Nakano; Hiroshi ; et al. | 2007-03-15 |
Lighting system and display apparatus using the same
App 20070035969 - Kaneko; Hiroki ; et al. | 2007-02-15 |
Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus
Grant 7,170,012 - Suwa , et al. January 30, 2 | 2007-01-30 |
Electroless copper plating solution, electroless copper plating process and production process of circuit board
Grant 7,169,216 - Itabashi , et al. January 30, 2 | 2007-01-30 |
Manufacturing method of printed wiring board as well as copper-clad laminate and treatment solutions used therefor
App 20060270232 - Kawamura; Toshinori ; et al. | 2006-11-30 |
Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus
Grant 7,095,623 - Suwa , et al. August 22, 2 | 2006-08-22 |
Metal structure and method of its production
App 20060180472 - Haba; Toshio ; et al. | 2006-08-17 |
Wiring board and production method thereof
App 20060163725 - Haba; Toshio ; et al. | 2006-07-27 |
Electroless plating method, electroless plating device, and production method and production device of semiconductor device
App 20060102485 - Nakano; Hiroshi ; et al. | 2006-05-18 |
Lighting source unit, illuminating apparatus using the same and display apparatus using the same
App 20060092634 - Hiyama; Ikuo ; et al. | 2006-05-04 |
Illuminating apparatus, method for fabricating the same and display apparatus using the same
App 20060091406 - Kaneko; Hiroki ; et al. | 2006-05-04 |
Member having metallic layer, its manufacturing method and its application
Grant 7,022,412 - Yoshida , et al. April 4, 2 | 2006-04-04 |
Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections
Grant 6,989,329 - Itabashi , et al. January 24, 2 | 2006-01-24 |
Wiring board and production method thereof, and semiconductor apparatus
App 20050271828 - Saito, Toshiro ; et al. | 2005-12-08 |
Electroless copper plating machine thereof, and multi-layer printed wiring board
App 20050252684 - Itabashi, Takeyiki ; et al. | 2005-11-17 |
Printed circuit board and method for processing printed circuit board
App 20050244621 - Arai, Kunio ; et al. | 2005-11-03 |
Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus
App 20050225956 - Suwa, Tokihito ; et al. | 2005-10-13 |
Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus
App 20050205297 - Suwa, Tokihito ; et al. | 2005-09-22 |
Semiconductor module and mounting method for same
Grant 6,940,162 - Eguchi , et al. September 6, 2 | 2005-09-06 |
High dielectric constant composite material and multilayer wiring board using the same
Grant 6,924,971 - Satsu , et al. August 2, 2 | 2005-08-02 |
Catalyst material and method of manufacturing the same and fuel cell using the same
App 20050158611 - Sugimasa, Masatoshi ; et al. | 2005-07-21 |
Electroless copper plating machine, and multi-layer printed wiring board
Grant 6,900,394 - Itabashi , et al. May 31, 2 | 2005-05-31 |
Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using same
App 20050087447 - Haba, Toshio ; et al. | 2005-04-28 |
Electroless copper plating solution, electroless copper plating process and production process of circuit board
App 20050079280 - Itabashi, Takeyuki ; et al. | 2005-04-14 |
Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections
App 20050042366 - Itabashi, Takeyuki ; et al. | 2005-02-24 |
Catalyst material and method of manufacturing the same and fuel cell using the same
App 20050031926 - Sugimasa, Masatoshi ; et al. | 2005-02-10 |
Semiconductor production method
App 20050029662 - Nakano, Hiroshi ; et al. | 2005-02-10 |
Electroless plating method, electroless plating device, and production method and production device of semiconductor device
App 20050022745 - Nakano, Hiroshi ; et al. | 2005-02-03 |
Semiconductor module and mounting method for same
App 20040251540 - Eguchi, Shuji ; et al. | 2004-12-16 |
Wiring substrate and an electroless copper plating solution for providing interlayer connections
Grant 6,831,009 - Itabashi , et al. December 14, 2 | 2004-12-14 |
Process and apparatus for manufacturing a semiconductor device
Grant 6,815,357 - Homma , et al. November 9, 2 | 2004-11-09 |
Electroless copper plating solution, electroless copper plating process and production process of circuit board
Grant 6,805,915 - Itabashi , et al. October 19, 2 | 2004-10-19 |
Semiconductor module and mounting method for same
Grant 6,784,541 - Eguchi , et al. August 31, 2 | 2004-08-31 |
Semiconductor device comprising stress relaxation layers and method for manufacturing the same
Grant 6,710,446 - Nagai , et al. March 23, 2 | 2004-03-23 |
Semiconductor device having cobalt alloy film with boron
Grant 6,680,540 - Nakano , et al. January 20, 2 | 2004-01-20 |
Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus
App 20030218871 - Suwa, Tokihito ; et al. | 2003-11-27 |
Member having metallic layer, its manufacturing method and its application
App 20030215620 - Yoshida, Hiroshi ; et al. | 2003-11-20 |
Electroless copper plating solution, the electroless copper plating supplementary solution, and the method of manufacturing wiring board
App 20030183120 - Itabashi, Takeyuki ; et al. | 2003-10-02 |
Semiconductor module and method of mounting
Grant 6,627,997 - Eguchi , et al. September 30, 2 | 2003-09-30 |
Process and apparatus for manufacturing a semiconductor device
App 20030098241 - Homma, Yoshio ; et al. | 2003-05-29 |
Plating method, plating solution, semiconductor device and process for producing the same
App 20030085467 - Kobayashi, Kinya ; et al. | 2003-05-08 |
Electric plating method, electric plating apparatus, program for plating, recording medium, and manufacturing method and manufacturing apparatus for semiconductor device
App 20030079683 - Nakano, Hiroshi ; et al. | 2003-05-01 |
Semiconductor module and mounting method for same
App 20030071348 - Eguchi, Shuji ; et al. | 2003-04-17 |
Electroless copper plating solution, electroless copper plating process and production process of circuit board
App 20030054094 - Itabashi, Takeyuki ; et al. | 2003-03-20 |
High dielectric constant composite material and multilayer wiring board using the same
App 20030030999 - Satsu, Yuichi ; et al. | 2003-02-13 |
High dielectric constant composite material and multilayer wiring board using the same
App 20020168510 - Satsu, Yuichi ; et al. | 2002-11-14 |
Lithium secondary battery, its electrolyte, and electric apparatus using the same
Grant 6,475,680 - Arai , et al. November 5, 2 | 2002-11-05 |
Wiring board and production method thereof, and semiconductor apparatus
App 20020148733 - Saito, Toshiro ; et al. | 2002-10-17 |
Semiconductor device and method of manufacture thereof
App 20020130412 - Nagai, Akira ; et al. | 2002-09-19 |
Method of making a semiconductor device having a stress relieving mechanism
Grant 6,423,571 - Ogino , et al. July 23, 2 | 2002-07-23 |
Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using same
App 20020084191 - Haba, Toshio ; et al. | 2002-07-04 |
Wiring substrate and manufacturing method of the same along with electroless copper plating solution used therefor
App 20020064947 - Itabashi, Takeyuki ; et al. | 2002-05-30 |
Semiconductor device and method for manufacturing the same technical field
Grant 6,396,145 - Nagai , et al. May 28, 2 | 2002-05-28 |
Semiconductor device having wires and insulator layers with via-studs
App 20020030283 - Itabashi, Takeyuki ; et al. | 2002-03-14 |
Method of making a semiconductor device having a stress relieving mechanism
App 20010051393 - Ogino, Masahiko ; et al. | 2001-12-13 |
Semiconducting system and production method
App 20010030366 - Nakano, Hiroshi ; et al. | 2001-10-18 |
Semiconductor device and method of manufacturing the same
Grant 6,300,244 - Itabashi , et al. October 9, 2 | 2001-10-09 |
Semiconductor device having a stress relieving mechanism
Grant 6,028,364 - Ogino , et al. February 22, 2 | 2000-02-22 |
Method for producing thin film multilayer wiring board
Grant 5,707,749 - Katagiri , et al. January 13, 1 | 1998-01-13 |
Method for formation of conductor using electroless plating
Grant 5,595,943 - Itabashi , et al. January 21, 1 | 1997-01-21 |
LSI package board
Grant 5,565,706 - Miura , et al. October 15, 1 | 1996-10-15 |
Process for the formation of a conductive circuit pattern
Grant 5,294,291 - Akahoshi , et al. March 15, 1 | 1994-03-15 |
Process for producing printed circuit board
Grant 5,028,513 - Murakami , et al. July 2, 1 | 1991-07-02 |
Circuit board and process for producing the same
Grant 5,021,296 - Suzuki , et al. June 4, 1 | 1991-06-04 |
Process for producing printed circuit board
Grant 4,876,177 - Akahoshi , et al. October 24, 1 | 1989-10-24 |
Method of bonding copper and resin
Grant 4,642,161 - Akahoshi , et al. February 10, 1 | 1987-02-10 |
Process for electroless copper plating
Grant 4,632,852 - Akahoshi , et al. December 30, 1 | 1986-12-30 |
Printed circuit board, process for preparing the same and resist ink used therefor
Grant 4,610,910 - Kawamoto , et al. September 9, 1 | 1986-09-09 |
Method for manufacture of printed wiring board
Grant 4,604,160 - Murakami , et al. August 5, 1 | 1986-08-05 |
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